Related Topics:
Column Name: PROCESS_TYPE
Description: The process type or sub-type associated with the fluorinated greenhouse gas (F-GHG) emission. Possible process types or subtypes: plasma etching, wafer cleaning, chamber cleaning - in situ plasma, chamber cleaning - in situ thermal, orchamber cleaning - remote plasma.
Envirofacts Table Name(s):
- EF_L_PROCESS_EF_ECF
- I_PV_MEMS_LCD_INFO
- I_SEMICONDUCTOR_INFO
- MV_EF_I_ANN_FGHG_PVMEMSLCD
- MV_EF_I_ANN_FGHG_SEMICONDUCTOR
- MV_EF_I_DRE_CLAIMED_GAS_INFO
- MV_EF_I_N2O_DRE_CLAIMEDGASINFO
- RCR_LU_PROCESS_CODE
Properties:
- Type:VARCHAR2
- Length:200
Definition Source:GHG/FacilitySiteInformation/FacilitySiteDetails/SubPartInformation/SubPartI/SubPartIReportingDetails/FabDetails/FabFluorinatedGreenHouseGasDetails/FabFluorinatedGreenHouseGasRowDetails/AnnualFluorinatedGreenHouseGasEmissionsByProcessTypeDetails/ProcessType