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Facility ID: 06075NRTHMUPPER
Facility Name and Address: TTM PRINTED CIRCUIT GROUP MULT ILAYER STAFFORD DIV 228 UPPER RD STAFFORDVILLE, CT 06077 Parent Company: TTM TECHNOLOGIES INC Industry: Bare Printed Circuit Board Manufacturing (334412) Chemical: Copper compounds Reports: View TRI Facility profile report for this facility View TRI Form R submissions by this facility |
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Production Related Waste Management for Selected Chemical
lchemid=N100
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Pollution Prevention Activities for Selected Chemical
Reporting Year | Section 8.10: Newly Implemented Source Reduction Activity | Section 8.10: Methods to Identify Activity | Section 8.11: Optional Pollution Prevention Information* |
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2021 |
Source Reduction:: S06: Other material modifications made
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Methods to Identify SR Opportunities: T11: Other
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S06: Lower copper content products reduced volume from etching processes Source Reduction - Mix of product being manufactured |
2019 |
Source Reduction:: W19: Other changes in operating practices[-0-4%]
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Methods to Identify SR Opportunities: T05: Employee recommendation (independent of a formal company program)
Methods to Identify SR Opportunities: T11: Other Barriers: B3-Barriers to P2 B3 - Concern that product quality may decline as a result of source reduction. |
W19: Updated the controller on one of the etch lines Source Reduction - Ensure proper ratio of etch and speed for different thickness of boards Source Reduction - Identified during PM by maintenance team Barriers to P2: B3 - Concern that product quality may decline as a result of source reduction. - processes are defined to ensure quality of the final product |
2015 |
Barriers to P2: Ways P2 Was Incorporated in Original Process Design - Copper substrate cannot be substituted |
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2014 |
Barriers: B7-Barriers to P2 B7 - No known substitutes or alternative technologies.
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Other Environmental Practices: Recycling - Increased recycling of material vs. disposal. Barriers to P2: B7 - No known substitutes or alternative technologies. - Copper substrate cannot be substituted. |
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2013 | Other Environmental Practices - The majority of the material recycled is metallic copper that is left over and not encorporated into the final product. Based upon customer design, there are varying degrees of scrap material associated with the process. All excess is recycled. | ||
2012 | Other Environmental Practices - The majority of the material recycled is metallic copper that is left over and not encorporated into the final product. Based upon customer design, there are varying degrees of scrap material associated with the process. All excess is recycled. | ||
2001 |
Source Reduction:: W32: Improved procedures for loading, unloading, and transfer operations
Source Reduction:: W52: Modified equipment, layout, or piping |
Methods to Identify SR Opportunities: T11: Other
Methods to Identify SR Opportunities: T11: Other |