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Facility ID: 03103SNMNC140AB
Facility Name and Address: SANMINA CORP. 140 ABBY RD MANCHESTER, NH 03103 Parent Company: SANMINA CORP Industry: Printed Circuit Assembly (Electronic Assembly) Manufacturing (334418) Chemical: Lead Reports: View TRI Facility profile report for this facility View TRI Form R submissions by this facility |
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Production Related Waste Management for Selected Chemical
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Pollution Prevention Activities for Selected Chemical
Reporting Year | Section 8.10: Newly Implemented Source Reduction Activity | Section 8.10: Methods to Identify Activity | Section 8.11: Optional Pollution Prevention Information* |
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2022 |
Source Reduction:: S12: Altered dimensions, components, or final design of product
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Methods to Identify SR Opportunities: T04: Participative team management
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S12: The plant is reducing the quantity of PCBA's containing lead through customer communications and new customers having lead free PCBA's. Source Reduction - Internal activities on working with our customers both existing and new on awareness of lead based products. |
2020 |
Source Reduction: Source Reduction - Product continues to trend to a higher percentage of lead free. Other Environmental Practices: Recycling - Tracking and monitoring waste streams to assure all wastes for recycling are identified and processed. |
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2019 |
Source Reduction: Source Reduction - Product continues to trend to lead free. Other Environmental Practices: Recycling - Tracking and monitoring waste streams to assure all wastes available for recyclingare identified and processed. |
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2018 |
Source Reduction:: W52: Modified equipment, layout, or piping[-25-49%]
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Methods to Identify SR Opportunities: T02: External pollution prevention opportunity audit(s)
Methods to Identify SR Opportunities: T04: Participative team management Methods to Identify SR Opportunities: T01: Internal pollution prevention opportunity audit(s) |
Source Reduction: Source Reduction - Process is trending to the manufacturing of more Lead free products Other Environmental Practices: Recycling - Tracking and monitoring waste streams to assure all wastes available for recycling are identified and processed. |
2017 |
Source Reduction:: W52: Modified equipment, layout, or piping
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Methods to Identify SR Opportunities: T10: Vendor assistance
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W52: Purchased new lead free free wave solder machine to expand lead free circuit board capacity to meet customer demand for lead free boards |
2016 |
Source Reduction:: W52: Modified equipment, layout, or piping[-50-99%]
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Methods to Identify SR Opportunities: T10: Vendor assistance
Methods to Identify SR Opportunities: T01: Internal pollution prevention opportunity audit(s) |
W52: Added a new lead free wave solder machine for increased output of no lead PCB's Source Reduction - More customers requesting lead free solder on their PCB products |
2015 |
Source Reduction:: W82: Modified design or composition of product[-5-14%]
Source Reduction:: W43: Substituted a feedstock or reagent chemical with a different chemical |
Methods to Identify SR Opportunities: T01: Internal pollution prevention opportunity audit(s)
Methods to Identify SR Opportunities: T04: Participative team management Methods to Identify SR Opportunities: T01: Internal pollution prevention opportunity audit(s) Methods to Identify SR Opportunities: T04: Participative team management |
Other Environmental Practices: Recycling - All materials or waste that contains lead are being recycled. Source Reduction: Source Reduction - Producing more lead free PCB's and less leaded boards. |
2014 |
Source Reduction:: W42: Substituted raw materials
Source Reduction:: W82: Modified design or composition of product |
Methods to Identify SR Opportunities: T04: Participative team management
Methods to Identify SR Opportunities: T10: Vendor assistance Methods to Identify SR Opportunities: T04: Participative team management Methods to Identify SR Opportunities: T10: Vendor assistance |
Source Reduction: Source Reduction - Continue to increase lead free builds, Invest in latest technology and equipment to improve production and decrease scrap which will decrease lead usage. |
2013 |
Source Reduction:: W42: Substituted raw materials
Source Reduction:: W81: Changed product specifications |
Methods to Identify SR Opportunities: T04: Participative team management
Methods to Identify SR Opportunities: T10: Vendor assistance Methods to Identify SR Opportunities: T10: Vendor assistance |
W42: Pb free solder W81: Focus on Pb free pcbs Source Reduction - Continue to increase Lead free builds, Lead free no-clean as default pcba process chemistry, reduces washing requirements less filter disposal |
2012 |
Source Reduction:: W42: Substituted raw materials
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Methods to Identify SR Opportunities: T01: Internal pollution prevention opportunity audit(s)
Methods to Identify SR Opportunities: T11: Other |
Other Environmental Practices - For RY2012, lead solder usage decreased due to customer mix and demand. RoHS/REACH directives also had impact to changes as compared to prior RY. Recycling programs remain active and are in place which has had a positive impact to reduce need for off-site processing. |
2011 |
Source Reduction:: W42: Substituted raw materials
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Methods to Identify SR Opportunities: T01: Internal pollution prevention opportunity audit(s)
Methods to Identify SR Opportunities: T11: Other |
W42: Using lead free solder alloy when meeting customer specifications Source Reduction - Recycling program for spent solder. Process improvements to reduce solder waste. Source Reduction - Using no-clean flux chemistry to mitigate lead waste disposal qty''s. Source Reduction - For RY2011, lead solder usage increased primarlly due to customer mix, and demand by customers requiring lead in solder due to industry sector. |
2010 |
Source Reduction:: W42: Substituted raw materials
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Methods to Identify SR Opportunities: T01: Internal pollution prevention opportunity audit(s)
Methods to Identify SR Opportunities: T11: Other |
Source Reduction - For RY2010, the percentage of pcba assemblies produced using lead free alternatives for soldering is increased significantly compared to prior ry. Solder alloy used in the circuit board assembly process is largely dependent on customer mix and intended industry. The recycling program for lead waste is active; 100% all lead waste is recycled. |
2009 |
Source Reduction:: W42: Substituted raw materials
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Methods to Identify SR Opportunities: T01: Internal pollution prevention opportunity audit(s)
Methods to Identify SR Opportunities: T11: Other |
Source Reduction - For RY2009, the percentage of pcba assemblies produced using lead free alternatives for soldering is higher than prior RY but remains in single digits. Soldering alloy used is largely customer dependent. The recycling program for lead waste is active; close to 100% all lead waste is recycled. |
2008 |
Source Reduction:: W42: Substituted raw materials
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Methods to Identify SR Opportunities: T01: Internal pollution prevention opportunity audit(s)
Methods to Identify SR Opportunities: T11: Other |
Other Environmental Practices - IN RY 2008, LEAD FREE SOLDERING PROCESSES REMAIN IN PLACE AS AN OFFERING TO OUR CUSTOMERS IN ORDER TO REDUCE THE AMOUNT OF LEAD USAGE IN THE FACILITY. THIS INCLUDES SN100 ALLOYS IN THE WAVE PROCESS, AND SAC ALLOY IN THE SMT PROCESS. ALSO, LEAD WASTE CONTINUES TO BE RECYCLED CLOSE TO 100% THROUGH A SINGLE METALS RECOVERY SERVICE. TRACE AMOUNTS OF LEAD WASTE FROM EVAPORATOR SLUDGE - WHICH IS NOT RECYCLED - IS HANDLED THROUGH ANOTHER SOURCE. DUE TO CHANGE IN CUSTOMER BASE, THERE HAS BEEN A DROP IN LEAD FREE USAGE. IN RY2008, LESS THAN 3% OF ALL PCB ASSEMBLIES WERE PROCESSED WITH LEAD FREE SOLDER ALLOYS (DOWN FROM 21% in RY2007). AS MORE CUSTOMERS MOVE TOWARD COMPLIANCE WITH GLOBAL ROHS/REACH REQUIREMENTS, THE VOLUME OF LEAD FREE ASSEMBLY SHOULD IMPROVE IN THE FUTURE. |
2007 |
Source Reduction:: W42: Substituted raw materials
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Methods to Identify SR Opportunities: T01: Internal pollution prevention opportunity audit(s)
Methods to Identify SR Opportunities: T11: Other |
Source Reduction - Pro-Active changes in ry 2007 which have allowed facility to recycle 100% of lead waste: 1. All lead associated haz waste now recycled at almost 100% through electrum (W/Exception to evaporator sludge in which amount is neglible). Pro-Active changes in ry 2007 which have allowed facility to reduce lead usage: 1. Transitioning to lead free based solders in pcba assembly process. This activity will continue based on customer mix and associated rohs requirements for their end products. In RY2007, 21% of all pcbas were processed with lead free solder alloys. |
2006 |
Source Reduction:: W42: Substituted raw materials
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Methods to Identify SR Opportunities: T11: Other
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2005 |
Source Reduction:: W13: Improved maintenance scheduling, recordkeeping, or procedures
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Methods to Identify SR Opportunities: T05: Employee recommendation (independent of a formal company program)
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2004 |
Source Reduction:: W13: Improved maintenance scheduling, recordkeeping, or procedures
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Methods to Identify SR Opportunities: T06: Employee recommendation (under a formal company program)
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2003 |
Source Reduction:: W42: Substituted raw materials
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Methods to Identify SR Opportunities: T11: Other
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2002 |
Source Reduction:: W52: Modified equipment, layout, or piping
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Methods to Identify SR Opportunities: T04: Participative team management
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2001 |
Source Reduction:: W52: Modified equipment, layout, or piping
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Methods to Identify SR Opportunities: T04: Participative team management
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