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Facility ID: 1462WDVNCC19JET
Facility Name and Address: ADVANCE CIRCUIT TECHNOLOGY INC. 19 JET VIEW DR ROCHESTER, NY 14624 Parent Company: UEC ELECTRONICS LLC Industry: Printed Circuit Assembly (Electronic Assembly) Manufacturing (334418) Chemical: Lead Reports: View TRI Facility profile report for this facility View TRI Form R submissions by this facility |
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Pollution Prevention Activities for Selected Chemical
Reporting Year | Section 8.10: Newly Implemented Source Reduction Activity | Section 8.10: Methods to Identify Activity | Section 8.11: Optional Pollution Prevention Information* |
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2021 |
Barriers: B7-Barriers to P2 B7 - No known substitutes or alternative technologies.
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Barriers to P2: B7 - No known substitutes or alternative technologies. - At this time there is no known substitute for lead |
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2018 |
Barriers: B7-Barriers to P2 B7 - No known substitutes or alternative technologies.
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Barriers to P2: B7 - No known substitutes or alternative technologies. - CERTAIN INDUSTRIES MUST USE LEAD AEROSPACE MILITARY. |
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2016 |
Barriers: B7-Barriers to P2 B7 - No known substitutes or alternative technologies.
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Barriers to P2: B7 - No known substitutes or alternative technologies. - LEAD SOLDER IS REQUIRED FOR US GOVERNMENT MILITARY ELECTRONICS LEAD SOLDER IS REQUIRED FOR CRYOGENIC ELECTRONICS |
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2015 |
Barriers: B7-Barriers to P2 B7 - No known substitutes or alternative technologies.
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Barriers to P2 - WE ARE A CONTRACT MANUFACTURER OUR CUSTOMERS CONTROL WHAT WE USE
Barriers to P2: B7 - No known substitutes or alternative technologies. - WE ARE A CONTRACT MANUFACTURER OUR CUSTOMERS CONTROL WHAT WE USE |
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2013 |
Other Barriers to Source Reduction - LEAD IS AN ALLOY IN SOLDERTHE SOLDER ALLOY IS CONTROLLED BY OUR CUSTOMERS WE HAVE NO CONTROLDOD REQUIRES LEAD SOLDER |