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Facility ID: 55431DDDVL9401J
Facility Name and Address: ADDED VALUE TECHNOLOGY 9401 JAMES AVE S SUITE 100 BLOOMINGTON, MN 55431 Parent Company: ADDED VALUE TECHNOLOGY LLC Industry: Printed Circuit Assembly (Electronic Assembly) Manufacturing (334418) Chemical: Lead Reports: View TRI Facility profile report for this facility View TRI Form R submissions by this facility |
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Production Related Waste Management for Selected Chemical
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Pollution Prevention Activities for Selected Chemical
Reporting Year | Section 8.10: Newly Implemented Source Reduction Activity | Section 8.10: Methods to Identify Activity | Section 8.11: Optional Pollution Prevention Information* |
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2020 |
Source Reduction:: W13: Improved maintenance scheduling, recordkeeping, or procedures
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Methods to Identify SR Opportunities: T04: Participative team management
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2019 |
Source Reduction:: W13: Improved maintenance scheduling, recordkeeping, or procedures
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Methods to Identify SR Opportunities: T04: Participative team management
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2018 |
Source Reduction:: W13: Improved maintenance scheduling, recordkeeping, or procedures
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Methods to Identify SR Opportunities: T04: Participative team management
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2016 |
Source Reduction:: W13: Improved maintenance scheduling, recordkeeping, or procedures
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Methods to Identify SR Opportunities: T04: Participative team management
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2015 |
Source Reduction:: W49: Other raw material modifications
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Methods to Identify SR Opportunities: T11: Other
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2014 |
Source Reduction:: W49: Other raw material modifications
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Methods to Identify SR Opportunities: T11: Other
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2013 |
Source Reduction:: W49: Other raw material modifications
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Methods to Identify SR Opportunities: T11: Other
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Source Reduction - Continue to suggest use of lead free alternatives on printed circuit boards Barriers to P2 - Tin lead solder is a requirement on some printed circuit designs and not subject to substitution of lead free alternatives |
2012 |
Source Reduction:: W49: Other raw material modifications
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Methods to Identify SR Opportunities: T11: Other
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Source Reduction - Encourage customers to use lead free options for their printed circuit boards Barriers to P2 - We manufacture printed circuit boards per customer specifications. Solder containing lead is a requirement on some designs and not subject to substitution of a lead free alternative |
2011 |
Source Reduction:: W49: Other raw material modifications
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Methods to Identify SR Opportunities: T11: Other
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W49: Lead usage is driven by customer requirements on the Printed Circuit Boards. The increase in lead usage for FY2011 was driven by a change in equipment maintenance that increased our usage but did not increase the discharge to the local POTW Source Reduction - When possible, we encourage our customers to use a lead free finish such as: electroless nickel/immersion gold or immersion tin. |
2010 |
Source Reduction:: W49: Other raw material modifications
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Methods to Identify SR Opportunities: T11: Other
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Source Reduction - Our lead usage is based on customer requirements for the products we manufacture. As the trend continues away from lead based products, our lead usage should continue to decline. |
2009 |
Source Reduction:: W49: Other raw material modifications
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Methods to Identify SR Opportunities: T11: Other
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2008 |
Source Reduction:: W49: Other raw material modifications
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Methods to Identify SR Opportunities: T11: Other
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Source Reduction - Our lead usage is based on customer requirements. The amount of lead used decreased because of the trend to switch to lead-free surface finishes |
2007 |
Source Reduction:: W49: Other raw material modifications
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Methods to Identify SR Opportunities: T11: Other
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2002 |
Source Reduction:: W22: Began to test outdated material - continue to use if still effective
Source Reduction:: W71: Other cleaning and degreasing modifications |
Methods to Identify SR Opportunities: T01: Internal pollution prevention opportunity audit(s)
Methods to Identify SR Opportunities: T01: Internal pollution prevention opportunity audit(s) |