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Facility ID: 5600WMCRCR69PWE
Facility Name and Address: EI MICROCIRCUITS 69 POWER DRIVE MANKATO, MN 56001 Parent Company: EI MICROCIRCUITS Industry: Printed Circuit Assembly (Electronic Assembly) Manufacturing (334418) Chemical: Lead Reports: View TRI Facility profile report for this facility View TRI Form R submissions by this facility |
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Production Related Waste Management for Selected Chemical
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Waste Management Comparison -
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Pollution Prevention Activities for Selected Chemical
Reporting Year | Section 8.10: Newly Implemented Source Reduction Activity | Section 8.10: Methods to Identify Activity | Section 8.11: Optional Pollution Prevention Information* |
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2018 |
Barriers to P2 - Lead use is a primary part of our business and is used in a majority of processes throughout our facility as required by our customers;, however lead usage is declining in our customer base.
Source Reduction: Source Reduction - All technically feasible prevention and reduciton plans are implemented. |
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2017 |
Barriers: B6-Barriers to P2 B6 - Pollution prevention previously implemented - additional reduction does not appear technically or economically feas
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Barriers to P2 - Lead use is a primary part of our business and is used in a majority of processes throughout our facility as required by our customers however lead usage is declining in our customer base.
Barriers to P2: B6 - Pollution prevention previously implemented - additional reduction does not appear technically or economically feas - All technically feasible prevention & reduction plans are implemented. |
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2016 |
Barriers: B6-Barriers to P2 B6 - Pollution prevention previously implemented - additional reduction does not appear technically or economically feas
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Other Barriers to Source Reduction - Lead use is a primary part of our business and is used in a majority of processes throughout our facility as required by our customers. As sales increase so will lead use, but even with increased sales lead use for all 3 facilities combined is being reduced. Barriers to P2: B6 - Pollution prevention previously implemented - additional reduction does not appear technically or economically feas - All technically feasible prevention & reduction plans are implemented. Other Environmental Practices: Recycling - We recycle all lead that is not used as an article in the assemblies we produce. |
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2015 |
Barriers: B6-No Information B6 - Pollution prevention previously implemented - additional reduction does not appear technically or economically feas
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Barriers to P2 - Lead use is a primary part of our business and is used in a majority of processes throughout our facility as required by our customers. As sales increase so will lead use, but even with increased sales lead use for all facilities combined is being reduced. | |
2013 |
Source Reduction:: W58: Other process modifications
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Methods to Identify SR Opportunities: T11: Other
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Source Reduction - The following pollution prevention actives were implemented during the start-up year and will be ongoing prevention activities.To reduce the generation of lead waste in our SMT process our company has a paste handling procedure in place to reduce the exposure of the wet solder paste to air to prevent the SnPb paste from drying out and having to be discarded. Based the volume of paste consumed by the process, this procedure only reduces our waste creation by a miniscule amount therefore the effectiveness of this practice is not able to be evaluated.To further reduce the generation of lead waste in our SMT process in 2009 a humidification system was installed in both our St. Peter location and our Mankato location to control the humidity levels during the winter months. The elevated humidity levels prevent paste in our SMT process from drying out and having to be scrapped when it becomes unusable. As stated in the above process based on the volume of paste consumed by the process, this procedure only reduces our waste creation by a miniscule amount therefore the effectiveness of this practice is not able to be evaluated.To reduce the generation of lead waste in our wave process our lead wave solder machine is only turned on when based on the production schedulre to reduce the amount of hours the SnPb solder is in the molten state. This will reduce the amount of dross oxides that form on the surface of the molten solder. Dross removal is only when needed by the production schedule which is very irregular during the start-up year of this facility so we are unable to evaluate the amount of reduction in lead waste for this process. On July 2006 a directive went into effect commonly referred to as RoHS directive (Restriction of Hazardous Substances) that required any product or consumer goods sold in the Europe union to be free of six hazardous materials one of which was lead. To meet this directives goals in late 2004 with the cooperation of our customers we started developing our lead-free process which eliminated the use of SnPb alloys in favor of a nearly pure tin alloys. Starting in 2005 some of our customer began producing their product using this new lead-free process. Over the past several years our customers have continued to switch to using lead-free alloys which has had the biggest amount of impact on the amount of lead used/purchased. |