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Facility ID: 75061WTKNC230IR
Facility Name and Address: NETVIA GROUP LLC 230 IRBY LN IRVING, TX 75061 Parent Company: EPEC LLC Industry: Bare Printed Circuit Board Manufacturing (334412) Chemical: Lead Reports: View TRI Facility profile report for this facility View TRI Form R submissions by this facility |
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Production Related Waste Management for Selected Chemical
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Pollution Prevention Activities for Selected Chemical
Reporting Year | Section 8.10: Newly Implemented Source Reduction Activity | Section 8.10: Methods to Identify Activity | Section 8.11: Optional Pollution Prevention Information* |
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2015 |
Source Reduction:: W13: Improved maintenance scheduling, recordkeeping, or procedures[-5-14%]
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Methods to Identify SR Opportunities: T11: Other
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W13: Reclaimed good tin/lead solder from dirty solder and solder dross, for reuse. Improved record-keeping related to this process. Source Reduction - customers opting less for products containing lead |
2014 |
Source Reduction:: W82: Modified design or composition of product[-0-4%]
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Methods to Identify SR Opportunities: T11: Other
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Source Reduction - Customers desire less tin-lead solder, so our lead use is declining. We are beginning a "lead log" to keep closer track of this metal. Other Environmental Practices: Recycling - Instead of sending our F006 wastewater treatment sludge to a stabilized landfill in Texas, we began sending it for metals recovery to Arizona. This, plus our recycling of tin-lead solder dross, has enabled us to recycle nearly all our lead. |
2013 |
Source Reduction:: W13: Improved maintenance scheduling, recordkeeping, or procedures
Source Reduction:: W14: Changed production schedule to minimize equipment and feedstock changeovers |
Methods to Identify SR Opportunities: T04: Participative team management
Methods to Identify SR Opportunities: T01: Internal pollution prevention opportunity audit(s) |
W13: Offered new and innovative soldering materials to eliminate use of PbSnsolder. RoHS requirements from Europe also dramatically reducing the products offered. W14: Bunched manufacturing orders to single start-ups twice per week. Eliminated excess dross and use of solder |
2012 |
Other Barriers to Source Reduction - NEW MORE ENVIRONMENTALLY FRIENDLY METALS ARE BEING USED IN PLACE OF LEAD SOLDER |
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2011 | Source Reduction - Industry trends continue to limit the use of Lead-based solder products with a continued strong movement toward satisfying the European initiatives to eliminate the use of lead. | ||
2010 | Source Reduction - Customer preference for non-lead finishes continues to grow. Production orders continue to fall each year for solder for commercial applications. Defense product has also seen a move away from Solder with new designs. | ||
2008 | Source Reduction - 1) we replaced our tin-Lead plating bath with electro-Tin plating bath several years ago, with consequent reduction in our use of lead. 2) the lead we currently use is in our hot-Air solder level (Hasl), which applies a layer of tin-Lead solder to circuit boards. We also reduced this form of lead usage several years ago through an upgrade in our maintenance staff. Our former practice was to replace the approximately 800 lbs of 63-37 [63% tin-37% lead] solder in our hasl whenver the copper content reached 0.3%. This would occur every few months. Now, we maintain our hasl by drossing the solder periodically. This process enables us to replenish the solder we use rather than replace the entire 800 lbs, a substantial reduction. 3) our customers prefer lead-Free processes, so the trend of our lead usage is downward. | ||
2007 | Source Reduction - We replaced our tin-Lead plating bath with electro-Tin plating bath several years ago, with consequent reduction in our use of lead. The lead we currently use is by way of our hot-Air solder level (Hasl), which applies a layer of tin-Lead solder to circuit boards. We also reduced this form of lead usage several years ago through an upgrade in our maintenance staff. Our former practice was to replace the approximately 800 lbs of 63-37 [63% tin-37% lead] solder in our hasl whenver the copper content reached 0.3%. This would occur every few months. Now, we maintain our hasl by drossing the solder periodically. The knowledge of this process by our current maintenance staff enables us to replenish the solder we use rather than replace the entire 800 lbs, which is a substantial reduction. Our present solder usage, and therefore our lead usage has probably reached the bare minimum required for our circuit board manufacturing process. | ||
2006 | Source Reduction - We replaced our tin-lead plating bath with electro-tin plating bath several years ago, with consequent reduction in our use of lead. The lead we currently use is by way of our hot-air solder level (HASL), which applies a layer of tin-lead solder to circuit boards. We also reduced this form of lead usage several years ago through an upgrade in our maintenance staff. Our former practice was to replace the approximately 800 lbs of 63-37 [63% tin-37% lead] solder in our HASL whenver the copper content reached 0.3%. This would occur every few months. Now, we maintain our HASL by drossing the solder periodically. The knowledge of this process by our current maintenance staff enables us to replenish the solder we use rather than replace the entire 800 lbs, which is a substantial reduction. Our present solder usage, and therefore our lead usage has probably reached the bare minimum required for our circuit board manufacturing process. | ||
2001 |
Source Reduction:: W58: Other process modifications
Source Reduction:: W73: Substituted coating materials used |
Methods to Identify SR Opportunities: T05: Employee recommendation (independent of a formal company program)
Methods to Identify SR Opportunities: T05: Employee recommendation (independent of a formal company program) |