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Facility ID: 80011JHNHH21100
Facility Name and Address: ADVANCED CIRCUITS INC 21101 E 32ND PKWY AURORA, CO 80011 Parent Company: COMPASS DIVERSIFIED Industry: Bare Printed Circuit Board Manufacturing (334412) Chemical: Copper Reports: View TRI Facility profile report for this facility View TRI Form R submissions by this facility |
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Production Related Waste Management for Selected Chemical
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Waste Management Comparison -
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Pollution Prevention Activities for Selected Chemical
Reporting Year | Section 8.10: Newly Implemented Source Reduction Activity | Section 8.10: Methods to Identify Activity | Section 8.11: Optional Pollution Prevention Information* |
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2022 |
Barriers: B8-Barriers to P2 B8 - A reduction does not appear to be technically feasible
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Barriers to P2: B8 - A reduction does not appear to be technically feasible - Copper is the primary conductive material in the fabrication of circuit boards. The trace work is created by additive and subtractive processes for Copper. This science is still in effect and there have been little movement away from using copper as the main conductive material. |
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2021 |
Barriers: B7-Barriers to P2 B7 - No known substitutes or alternative technologies.
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Barriers to P2: B7 - No known substitutes or alternative technologies. - Copper is an extremely conductive metal. For circuit board manufacturing, there are no known substitutes for this metal for this application. |
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2020 |
Barriers: B7-Barriers to P2 B7 - No known substitutes or alternative technologies.
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Other Environmental Practices: Waste Treatment - Our facility maintains 2 Ion Exchange resin systems that extract the Copper, along with other metals, from our rinses. Both systems have 3 ion exchange columns and process roughly 60 GPM. We also maintain extra resin just in case the resin in the columns become fouled we have the capacity to repack in a short period of time. Barriers to P2: B7 - No known substitutes or alternative technologies. - Copper is the main conductive material for circuit boards. |
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2019 |
Barriers: B7-Barriers to P2 B7 - No known substitutes or alternative technologies.
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Barriers to P2: B7 - No known substitutes or alternative technologies. - The fabrication of a circuit board involves copper additive and subtractive processes to generate the conductive pathways designed in the circuit boards. We are already pattern plating which minimizes the amount of copper having to be etched (removed) during the process. At this stage, further reduction in copper use is not feasible. |
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2018 |
Barriers: B7-Barriers to P2 B7 - No known substitutes or alternative technologies.
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Barriers to P2: B7 - No known substitutes or alternative technologies. - The fabrication of a circuit board involves copper additive and subtractive processes to generate the conductive pathways designed in the circuit boards. We are already pattern plating which minimizes the amount of copper having to be etched (removed) during the process. At this stage, further reduction in copper use is not feasible. |
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2008 |
Source Reduction:: W49: Other raw material modifications
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Methods to Identify SR Opportunities: T11: Other
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Source Reduction - Replaced anode spheres with anode balls on the pattern plate line. |