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Facility ID: 85281CRCTX2149E
Facility Name and Address: ADVANCED CIRCUITS INC 229 S CLARK DR TEMPE, AZ 85281 Parent Company: ADVANCED CIRCUITS INC Industry: Bare Printed Circuit Board Manufacturing (334412) Chemical: Lead Reports: View TRI Facility profile report for this facility View TRI Form R submissions by this facility |
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Production Related Waste Management for Selected Chemical
lchemid=007439921
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Waste Management Comparison -
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Pollution Prevention Activities for Selected Chemical
Reporting Year | Section 8.10: Newly Implemented Source Reduction Activity | Section 8.10: Methods to Identify Activity | Section 8.11: Optional Pollution Prevention Information* |
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2018 |
Barriers: B7-Barriers to P2 B7 - No known substitutes or alternative technologies.
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Other Barriers to Source Reduction - 2019 we will install a new waste treatment system that will reduce our discharge amount Barriers to P2: B7 - No known substitutes or alternative technologies. - Military still requires solder surface on printed circuit boards |
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2017 |
Barriers: B6-Barriers to P2 B6 - Pollution prevention previously implemented - additional reduction does not appear technically or economically feas
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Other Environmental Practices: Recycling - This metal recycled and sent off site for recycling Barriers to P2: B6 - Pollution prevention previously implemented - additional reduction does not appear technically or economically feas - We no longer electro-plate sn/pb and the only sn/pb is in a molten state. Customer requirements for sn/pb on the product required. |
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2016 |
Barriers: B7-Barriers to P2 B7 - No known substitutes or alternative technologies.
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Barriers to P2: B7 - No known substitutes or alternative technologies. - Building Military products require using lead in some cases. Source Reduction: Source Reduction - No longer have a sn/pb plating bath. |
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2015 |
Source Reduction:: W81: Changed product specifications[-50-99%]
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Methods to Identify SR Opportunities: T10: Vendor assistance
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Source Reduction - Vendors no longer require tin/lead electro-plating Source Reduction: Source Reduction - Eliminated Tin Lead Plating bath |
2013 |
Source Reduction - In 2013 we eliminated our tin/lead plating bath which reduced our lead waste as we only due hot air solder leveling on customers that still require a tin/lead connection on there bare boards.
Other Barriers to Source Reduction - Use of this material is driven by customer requirements. |
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2012 |
Other Barriers to Source Reduction - Lead is slowly being phased out by end users but some military still require solder on printed wiring boards. |
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2004 |
Source Reduction:: W82: Modified design or composition of product
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Methods to Identify SR Opportunities: T09: Trade association/industry technical assistance program
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