TRI Pollution Prevention Report for NETVIA GROUP LLC and Lead

Facility ID: 75061WTKNC230IR

Facility Name and Address:
NETVIA GROUP LLC
230 IRBY LN
IRVING, TX 75061

Parent Company: EPEC LLC

Industry: Bare Printed Circuit Board Manufacturing (334412)
Chemical: Lead

Production Related Waste Management for Selected Chemical


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    Waste Management Comparison - 2014



Pollution Prevention Activities for Selected Chemical


Reporting Year Section 8.10: Newly Implemented Source Reduction Activity Section 8.10: Methods to Identify Activity Section 8.11: Optional Pollution Prevention Information*
2015 Source Reduction:: W13: Improved maintenance scheduling, recordkeeping, or procedures[-5-14%]
Methods to Identify SR Opportunities: T11: Other
W13: Reclaimed good tin/lead solder from dirty solder and solder dross, for reuse. Improved record-keeping related to this process.

Source Reduction - customers opting less for products containing lead
2014 Source Reduction:: W82: Modified design or composition of product[-0-4%]
Methods to Identify SR Opportunities: T11: Other
Source Reduction - Customers desire less tin-lead solder, so our lead use is declining. We are beginning a "lead log" to keep closer track of this metal.

Other Environmental Practices: Recycling - Instead of sending our F006 wastewater treatment sludge to a stabilized landfill in Texas, we began sending it for metals recovery to Arizona. This, plus our recycling of tin-lead solder dross, has enabled us to recycle nearly all our lead.

2013 Source Reduction:: W13: Improved maintenance scheduling, recordkeeping, or procedures
Source Reduction:: W14: Changed production schedule to minimize equipment and feedstock changeovers
Methods to Identify SR Opportunities: T04: Participative team management
Methods to Identify SR Opportunities: T01: Internal pollution prevention opportunity audit(s)
W13: Offered new and innovative soldering materials to eliminate use of PbSnsolder. RoHS requirements from Europe also dramatically reducing the products offered.
W14: Bunched manufacturing orders to single start-ups twice per week. Eliminated excess dross and use of solder

2012 Other Barriers to Source Reduction - NEW MORE ENVIRONMENTALLY FRIENDLY METALS ARE BEING USED IN PLACE OF LEAD SOLDER

2011 Source Reduction - Industry trends continue to limit the use of Lead-based solder products with a continued strong movement toward satisfying the European initiatives to eliminate the use of lead.
2010 Source Reduction - Customer preference for non-lead finishes continues to grow. Production orders continue to fall each year for solder for commercial applications. Defense product has also seen a move away from Solder with new designs.
2008 Source Reduction - 1) we replaced our tin-Lead plating bath with electro-Tin plating bath several years ago, with consequent reduction in our use of lead. 2) the lead we currently use is in our hot-Air solder level (Hasl), which applies a layer of tin-Lead solder to circuit boards. We also reduced this form of lead usage several years ago through an upgrade in our maintenance staff. Our former practice was to replace the approximately 800 lbs of 63-37 [63% tin-37% lead] solder in our hasl whenver the copper content reached 0.3%. This would occur every few months. Now, we maintain our hasl by drossing the solder periodically. This process enables us to replenish the solder we use rather than replace the entire 800 lbs, a substantial reduction. 3) our customers prefer lead-Free processes, so the trend of our lead usage is downward.
2007 Source Reduction - We replaced our tin-Lead plating bath with electro-Tin plating bath several years ago, with consequent reduction in our use of lead. The lead we currently use is by way of our hot-Air solder level (Hasl), which applies a layer of tin-Lead solder to circuit boards. We also reduced this form of lead usage several years ago through an upgrade in our maintenance staff. Our former practice was to replace the approximately 800 lbs of 63-37 [63% tin-37% lead] solder in our hasl whenver the copper content reached 0.3%. This would occur every few months. Now, we maintain our hasl by drossing the solder periodically. The knowledge of this process by our current maintenance staff enables us to replenish the solder we use rather than replace the entire 800 lbs, which is a substantial reduction. Our present solder usage, and therefore our lead usage has probably reached the bare minimum required for our circuit board manufacturing process.
2006 Source Reduction - We replaced our tin-lead plating bath with electro-tin plating bath several years ago, with consequent reduction in our use of lead. The lead we currently use is by way of our hot-air solder level (HASL), which applies a layer of tin-lead solder to circuit boards. We also reduced this form of lead usage several years ago through an upgrade in our maintenance staff. Our former practice was to replace the approximately 800 lbs of 63-37 [63% tin-37% lead] solder in our HASL whenver the copper content reached 0.3%. This would occur every few months. Now, we maintain our HASL by drossing the solder periodically. The knowledge of this process by our current maintenance staff enables us to replenish the solder we use rather than replace the entire 800 lbs, which is a substantial reduction. Our present solder usage, and therefore our lead usage has probably reached the bare minimum required for our circuit board manufacturing process.
2001 Source Reduction:: W58: Other process modifications
Source Reduction:: W73: Substituted coating materials used
Methods to Identify SR Opportunities: T05: Employee recommendation (independent of a formal company program)
Methods to Identify SR Opportunities: T05: Employee recommendation (independent of a formal company program)
*Classifications of Optional Pollution Prevention Information shown in brackets are provided by EPA.


TRI Pollution Prevention Glossary

The Waste Management Hierarchy

The waste management hierarchy established by the Pollution Prevention Act (PPA) guides waste generators toward the best options for managing wastes. The preferred option is to prevent pollution at its source, but for waste that is generated, the preferred management methods are recycling, followed by burning for energy recovery, treatment and, as a last resort, disposing of the waste.
  • Source Reduction includes activities that eliminate or reduce the generation of chemical waste.
  • Recycling includes the recovery of a toxic chemical in waste for reuse.
  • Energy Recovery includes the combustion of toxic chemicals in waste to generate heat or electricity.
  • Treatment includes the destruction of a toxic chemical in waste.
  • Disposal or Other Releases includes toxic chemical quantities entering the environment.
The PPA requires facilities to provide the following details about each chemical they report to TRI:
Facilities may also provide optional Pollution Prevention Information describing their source reduction, recycling, or pollution control activities.