Production Related Waste Management for Selected Chemical
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Waste Management Comparison - 2020
Pollution Prevention Activities for Selected Chemical
| Reporting Year | Section 8.10: Newly Implemented Source Reduction Activity | Section 8.10: Methods to Identify Activity | Section 8.11: Optional Pollution Prevention Information* |
|---|---|---|---|
| 2021 |
Other Barriers to Source Reduction - Lead in printed circuit boards is requested by our customers. US regulation or direction would be required to reduce lead usage. |
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| 2020 |
Other Environmental Practices: Recycling - We have instituted processes to ensure that 100% of lead waste is sent to our recycling partners and is not disposed of in public landfills or on site. |
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| 2019 |
Other Barriers to Source Reduction - As a contract manufacturer, we do not dictate whether our products are made with lead or lead free. Most assemblies are lead free, however products that do not ship the the EU can be made with lead solder. Regulations in the US aimed at reducing lead solder in electronic assemblies would be the only viable optio to further reduce the amount of lead solder we consume. However, we have seen a trend of a decreasing amount of leaded assemblies produced, year over year. The leaded assemblies we do produce are typically smaller and use less lead solder than in the past. |
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| 2018 |
Barriers: B5-Barriers to P2 B5 - Specific regulatory/permit burdens.
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Barriers to P2: B5 - Specific regulatory/permit burdens. - We are a contract manufacturer that uses lead when our customers request it for their assemblies. If there were a regulation in the US (such as RoHS in the EU) to prohibit the use of tin-lead solder in most applications, we would be able to greatly reduce our usage of lead. |
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| 2015 |
Other Barriers to Source Reduction - As a contract manufacturer, we do not decide whether the products we produce are leaded or tin-lead. Many of our customer have switched over to lead-free processes, but there are still some customers with legacy products which are still made with leaded solder. The RoHS initiative in the EU has helped push the industry towards lead free processes, but without similar legislation in the US to incentivize the electronics designers (our customers) to go lead-free, we will likely always support the manufacture of leaded assemblies. |
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| 2014 |
Other Barriers to Source Reduction - Usage of lead is steadily decreasing due to RoHS standards. However, as a contract manufacturer, we do not directly control whether the assemblies we build use lead free or tin-lead solder. Many of our customers' legacy products still use tin-lead solder, and as such we cannot engage in source reduction activities. |
TRI Pollution Prevention Glossary
The Waste Management Hierarchy |
The waste management hierarchy established by the Pollution Prevention Act (PPA) guides waste generators toward the best options for managing wastes.
The preferred option is to prevent pollution at its source, but for waste that is generated, the preferred management methods are recycling, followed
by burning for energy recovery, treatment and, as a last resort, disposing of the waste.
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- A breakdown of production-related waste managed. This includes all amounts of the chemical released directly to the environment or otherwise managed as waste, other than waste generated by one-time events not associated with normal production processes (e.g., fires or remedial actions).
- A production ratio or activity index to provide context for reported toxic chemical quantities. For example, if a chemical is used in the manufacture of refrigerators, the production index would track the number of refrigerators produced and could be used to help gauge how much of the chemical is being released per unit of production.
- Any newly implemented source reduction activities, reported using "W-codes" (e.g., "W41: Increased purity of raw materials")