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Under the Pollution Prevention Act of 1990 (PPA), TRI collects information to track industry progress in reducing waste generation and moving towards safer waste management alternatives. Measures that facilities have taken to prevent pollution and reduce the amount of toxic chemicals entering the environment are shown in the table below. Although factors other than these reported practices contribute to year-to-year changes in releases, results are sorted by largest reduction in order to facilitate identification of pollution prevention successes. View the to learn about this report's features.




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List of Facilities in TRI submitting Pollution Prevention Information for Selected Criteria:

Year: between 2016 and 2024
 P2 Text Filters:
Year-to-Year Comparison:
TRI Facility ID Facility Name Address Chemical Name Industry Year Prior Year Release * Current Year Release * Percent Change Pollution Prevention Information (Activity Codes/Text/[Reduction]) P2 Report P2 Report URL
05452BMXXX1000R GLOBALFOUNDRIES U.S. 2 LLC - VERMONT FACILITY (GLOBALFOUNDRIES US INC) 1000 RIVER ST,
ESSEX JUNCTION,
VT 05452		 Ozone 334413: Semiconductor and Related Device Manufacturing 2016 2.00 0 -100 Source Reduction: W52: Modified equipment, layout, or piping - Equipment that generates ozone is equipped with point-of-use ozone destruct units to minimize ozone emissions at the tool exhaust. Continued efforts in 2016 to optimize ozone destruct technology for certain tool processes.

 //enviro.epa.gov/enviro/P2_EF_Query.p2_report?FacilityId=05452BMXXX1000R&ChemicalId=0010028156&ReportingYear=2016&DocCtrlNum=1316215701982&Opt=0
05452BMXXX1000R GLOBALFOUNDRIES U.S. 2 LLC - VERMONT FACILITY (GLOBALFOUNDRIES US INC) 1000 RIVER ST,
ESSEX JUNCTION,
VT 05452		 Polycyclic aromatic compounds 334413: Semiconductor and Related Device Manufacturing 2016 1.21 .005 -99.59 Source Reduction: W42: Substituted raw materials - Polycyclic aromatic compounds are a component of fuel oil used to heat the facility. The facility is on interruptible natural gas and must switch to fuel oil during natural gas service interruptions. The facility uses as little fuel oil as possible, but must use it to keep the facility operating when natural gas is not available. In 2016, the facility finished a two phase project to convert the site boilers to burn number 2 fuel oil which contains a significantly smaller amount of Polycyclic aromatic compounds. The first half of the conversion was completed in 2015 and the remaining half of the conversion was completed in 2016. This chemical is not expected to require TRI reporting after RY2016.

 //enviro.epa.gov/enviro/P2_EF_Query.p2_report?FacilityId=05452BMXXX1000R&ChemicalId=N590&ReportingYear=2016&DocCtrlNum=1316215701994&Opt=0
05452BMXXX1000R GLOBALFOUNDRIES U.S. 2 LLC - VERMONT FACILITY (GLOBALFOUNDRIES US INC) 1000 RIVER ST,
ESSEX JUNCTION,
VT 05452		 Benzo[g,h,i]perylene 334413: Semiconductor and Related Device Manufacturing 2016 .02 .001 -93.33 Source Reduction: W42: Substituted raw materials - Benzo(g,h,i)perylene is a component of fuel oil used to heat the facility. The facility is on interruptible natural gas and must switch to fuel oil during natural gas service interruptions. The facility uses as little fuel oil as possible, but must use it to keep the facility operating when natural gas is not available. In 2016, the facility finished a two phase project to convert the site boilers to burn number 2 fuel oil which contains a significantly smaller amount of Benzo(g,h,i)perylene. The first half of the conversion was completed in 2015 and the remaining half of the conversion was completed in 2016. This chemical is not expected to require TRI reporting after RY2016.

 //enviro.epa.gov/enviro/P2_EF_Query.p2_report?FacilityId=05452BMXXX1000R&ChemicalId=0000191242&ReportingYear=2016&DocCtrlNum=1316215701917&Opt=0
05452BMXXX1000R GLOBALFOUNDRIES U.S. 2 LLC - VERMONT FACILITY (GLOBALFOUNDRIES US INC) 1000 RIVER ST,
ESSEX JUNCTION,
VT 05452		 Ammonia 334413: Semiconductor and Related Device Manufacturing 2017 19,937.00 9,286.00 -53.42 Source Reduction: W53: Use of a differant process catalyst - Mask House project for Hydrochloric Acid (HCl) and Ammonium Hydroxide reduction by replacing the chromium wet etch with a dry etch. The dry chromium etching process, uses a chlorine and oxygen plasma to remove the exposed chromium eliminating the use of Ammonia, Sulfuric, and Hydrochloric chemicals in these steps.
Source Reduction: W58: Other process modifications - Project 1: POST BPSG Chemical Mechanical Polish clean elimination: This step utilized Hydrochloric Acid, Hydrogen peroxide, sulfuric acid, Dilute Hydrofluoric Acid, and Ammonium Hydroxide.Project 2 : Post Chemical Mechanical Polish Mc A/B Clean elimination: A clean step post Chemical Mechanical polish process was eliminated. This step utilized Hydrofluoric acid and Ammonium Hydroxide.

 //enviro.epa.gov/enviro/P2_EF_Query.p2_report?FacilityId=05452BMXXX1000R&ChemicalId=0007664417&ReportingYear=2017&DocCtrlNum=1317216341141&Opt=0
05452BMXXX1000R GLOBALFOUNDRIES U.S. 2 LLC - VERMONT FACILITY (GLOBALFOUNDRIES US INC) 1000 RIVER ST,
ESSEX JUNCTION,
VT 05452		 Ammonia 334413: Semiconductor and Related Device Manufacturing 2023 38,431.00 20,145.00 -47.58 Source Reduction: S25: Other process modifications made

 //enviro.epa.gov/enviro/P2_EF_Query.p2_report?FacilityId=05452BMXXX1000R&ChemicalId=0007664417&ReportingYear=2023&DocCtrlNum=1323222342610&Opt=0
05452BMXXX1000R GLOBALFOUNDRIES U.S. 2 LLC - VERMONT FACILITY (GLOBALFOUNDRIES US INC) 1000 RIVER ST,
ESSEX JUNCTION,
VT 05452		 Ozone 334413: Semiconductor and Related Device Manufacturing 2023 51.00 31.00 -39.22 Source Reduction: S25: Other process modifications made

 //enviro.epa.gov/enviro/P2_EF_Query.p2_report?FacilityId=05452BMXXX1000R&ChemicalId=0010028156&ReportingYear=2023&DocCtrlNum=1323222263028&Opt=0
05452BMXXX1000R GLOBALFOUNDRIES U.S. 2 LLC - VERMONT FACILITY (GLOBALFOUNDRIES US INC) 1000 RIVER ST,
ESSEX JUNCTION,
VT 05452		 Fluorine 334413: Semiconductor and Related Device Manufacturing 2021 1,606.00 1,022.00 -36.36 Source Reduction: S25: Other process modifications made

 //enviro.epa.gov/enviro/P2_EF_Query.p2_report?FacilityId=05452BMXXX1000R&ChemicalId=0007782414&ReportingYear=2021&DocCtrlNum=1321220439513&Opt=0
05452BMXXX1000R GLOBALFOUNDRIES U.S. 2 LLC - VERMONT FACILITY (GLOBALFOUNDRIES US INC) 1000 RIVER ST,
ESSEX JUNCTION,
VT 05452		 N-Methyl-2-pyrrolidone 334413: Semiconductor and Related Device Manufacturing 2020 3,169.00 2,161.00 -31.81 Other Environmental Practices: Energy Recovery - N- Methyl-2-Pyrrolidone (NMP) WASTERECLAMATION. Alarge portion of NMPwaste was reclaimed and fuel blended for energyrecovery.
Other Environmental Practices: Recycling - N- Methyl-2-Pyrrolidone (NMP) WASTERECYCLE. Alarge portion of NMPwaste was recycled through solvent recovery off-site. 		//enviro.epa.gov/enviro/P2_EF_Query.p2_report?FacilityId=05452BMXXX1000R&ChemicalId=0000872504&ReportingYear=2020&DocCtrlNum=1320219327766&Opt=0
05452BMXXX1000R GLOBALFOUNDRIES U.S. 2 LLC - VERMONT FACILITY (GLOBALFOUNDRIES US INC) 1000 RIVER ST,
ESSEX JUNCTION,
VT 05452		 N-Methyl-2-pyrrolidone 334413: Semiconductor and Related Device Manufacturing 2023 2,518.00 1,718.00 -31.77 Source Reduction: S25: Other process modifications made

 //enviro.epa.gov/enviro/P2_EF_Query.p2_report?FacilityId=05452BMXXX1000R&ChemicalId=0000872504&ReportingYear=2023&DocCtrlNum=1323222263511&Opt=0
05452BMXXX1000R GLOBALFOUNDRIES U.S. 2 LLC - VERMONT FACILITY (GLOBALFOUNDRIES US INC) 1000 RIVER ST,
ESSEX JUNCTION,
VT 05452		 Ethylene glycol 334413: Semiconductor and Related Device Manufacturing 2023 1,165.00 802.00 -31.16 Source Reduction: S25: Other process modifications made

 //enviro.epa.gov/enviro/P2_EF_Query.p2_report?FacilityId=05452BMXXX1000R&ChemicalId=0000107211&ReportingYear=2023&DocCtrlNum=1323222294771&Opt=0
05452BMXXX1000R GLOBALFOUNDRIES U.S. 2 LLC - VERMONT FACILITY (GLOBALFOUNDRIES US INC) 1000 RIVER ST,
ESSEX JUNCTION,
VT 05452		 Hydrogen fluoride 334413: Semiconductor and Related Device Manufacturing 2020 4,127.00 2,948.00 -28.57 Source Reduction: W58: Other process modifications

 //enviro.epa.gov/enviro/P2_EF_Query.p2_report?FacilityId=05452BMXXX1000R&ChemicalId=0007664393&ReportingYear=2020&DocCtrlNum=1320219327754&Opt=0
05452BMXXX1000R GLOBALFOUNDRIES U.S. 2 LLC - VERMONT FACILITY (GLOBALFOUNDRIES US INC) 1000 RIVER ST,
ESSEX JUNCTION,
VT 05452		 Sulfuric acid (acid aerosols including mists, vapors, gas, fog, and other airborne forms of any particle size) 334413: Semiconductor and Related Device Manufacturing 2022 841.00 607.00 -27.82 Source Reduction: S25: Other process modifications made

 //enviro.epa.gov/enviro/P2_EF_Query.p2_report?FacilityId=05452BMXXX1000R&ChemicalId=0007664939&ReportingYear=2022&DocCtrlNum=1322221335159&Opt=0
05452BMXXX1000R GLOBALFOUNDRIES U.S. 2 LLC - VERMONT FACILITY (GLOBALFOUNDRIES US INC) 1000 RIVER ST,
ESSEX JUNCTION,
VT 05452		 N-Methyl-2-pyrrolidone 334413: Semiconductor and Related Device Manufacturing 2016 820.00 600.00 -26.83 Source Reduction: W42: Substituted raw materials - NMP clean process on certain tools was replaced with a de-ionized (DI) water rinse process. It appears that the DI water does as effective a job as NMP. This is a shorter rinse and eliminated the use of 2190 liters of NMP per year. This process change was instituted on an additional tool in early 2016, thereby resulting in additional chemical savings in 2016. The savings in 2016 from this process change was 2,374 pounds of NMP.
Source Reduction: W51: Instituted recirculation within a process - At tool recycle capability is utilized. The equipment allows chemical recycling and reuse of NMP allowing the chemical to be used several times before disposal. In 2016, 7,049 pounds of NMP was recycled at the tools. 271,686 pounds of a chemical stripper that contains 70% NMP, was also recycled at the tool in 2016 using a similar process.

Other Environmental Practices: Energy Recovery - In 2016, GLOBALFOUNDRIES U.S. 2 LLC continued to consolidate drummed and bulk NMP waste. This consolidated waste stream was sent off site for fuel blending. Total amount of NMP waste sent for fuel blend in 2016 was 90,480 pounds. 		//enviro.epa.gov/enviro/P2_EF_Query.p2_report?FacilityId=05452BMXXX1000R&ChemicalId=0000872504&ReportingYear=2016&DocCtrlNum=1316215701956&Opt=0
05452BMXXX1000R GLOBALFOUNDRIES U.S. 2 LLC - VERMONT FACILITY (GLOBALFOUNDRIES US INC) 1000 RIVER ST,
ESSEX JUNCTION,
VT 05452		 Hydrochloric acid (acid aerosols including mists, vapors, gas, fog, and other airborne forms of any particle size) 334413: Semiconductor and Related Device Manufacturing 2019 962.00 705.00 -26.72 Source Reduction: W58: Other process modifications

 //enviro.epa.gov/enviro/P2_EF_Query.p2_report?FacilityId=05452BMXXX1000R&ChemicalId=0007647010&ReportingYear=2019&DocCtrlNum=1319218449573&Opt=0
05452BMXXX1000R GLOBALFOUNDRIES U.S. 2 LLC - VERMONT FACILITY (GLOBALFOUNDRIES US INC) 1000 RIVER ST,
ESSEX JUNCTION,
VT 05452		 Ethylene glycol 334413: Semiconductor and Related Device Manufacturing 2020 1,060.00 800.00 -24.53 Source Reduction: W42: Substituted raw materials

 //enviro.epa.gov/enviro/P2_EF_Query.p2_report?FacilityId=05452BMXXX1000R&ChemicalId=0000107211&ReportingYear=2020&DocCtrlNum=1320219344355&Opt=0
05452BMXXX1000R GLOBALFOUNDRIES U.S. 2 LLC - VERMONT FACILITY (GLOBALFOUNDRIES US INC) 1000 RIVER ST,
ESSEX JUNCTION,
VT 05452		 Sulfuric acid (acid aerosols including mists, vapors, gas, fog, and other airborne forms of any particle size) 334413: Semiconductor and Related Device Manufacturing 2016 700.00 538.00 -23.14 Source Reduction: W42: Substituted raw materials - Migrated some of the wet etch processes that use sulfuric acid in the mask manufacturing line to a dry etch process. In 2015, full qualification and 25 % of this conversion were completed. The full implementation occurred in 2016. This resulted in the following chemical savings: 836 gals of PEH-3 (Hydrochloric Acid containing chemistry), 656 gals of CR-7 etchant, 435 gals of sulfuric acid
Source Reduction: W58: Other process modifications - In 2016, the surface prep team worked on optimizing multiple chemical cleaning steps, and where technically feasible combining them into one chemical cleaning step, thus resulting in process optimizations and associated chemical savings. The chemical savings resulting from multiple process optimizations in 2016 were as follows: Ammonium Hydroxide 827 gals, Hydrogen Peroxide 3537 gals, Hydrochloric Acid 672 gals, Isopropyl Alcohol 8818 gals, Sulfuric Acid 5683 gals, Hot DI 694,230 gals, Cold DI water 390,512 gals, Hydrofluoric Acid 41 gals
Source Reduction: W78: Other surface preparation and finishing modifications - Product Batch Size Optimizations for optimized chemical use: In 2015, the surface prep team began evaluation of batch size optimizations on certain manufacturing tools. The goal of this project was to optimize batch size so more product could be run using the same amount of chemical. The idea was implemented in 2016. The chemicals optimized included hydrofluoric acid, sulfuric acid, hydrogen peroxide, hydrochloric acid, and ammonium hydroxide. Chemical savings from batching were 13% on one tool set and 24 % on the other tool set.

 //enviro.epa.gov/enviro/P2_EF_Query.p2_report?FacilityId=05452BMXXX1000R&ChemicalId=0007664939&ReportingYear=2016&DocCtrlNum=1316215702008&Opt=0
05452BMXXX1000R GLOBALFOUNDRIES U.S. 2 LLC - VERMONT FACILITY (GLOBALFOUNDRIES US INC) 1000 RIVER ST,
ESSEX JUNCTION,
VT 05452		 Hydrochloric acid (acid aerosols including mists, vapors, gas, fog, and other airborne forms of any particle size) 334413: Semiconductor and Related Device Manufacturing 2018 1,188.00 962.00 -19.02 Source Reduction: W58: Other process modifications - Project 1: POST BPSG Chemical Mechanical Polish clean elimination: This step utilized Hydrochloric Acid, Hydrogen peroxide, sulfuric acid, Dilute Hydrofluoric Acid, and Ammonium Hydroxide.Project 2: Chemical optimizations on the FSI tools (Hydrochloric Acid, Sulfuric Acid and Hydrogen Peroxide). A newer process was qualified on the FSI spray tools that runs a reduced process recipe time. Full technical feasibility assessments were completed and the project is fully implemented on certain high volume technologies.

 //enviro.epa.gov/enviro/P2_EF_Query.p2_report?FacilityId=05452BMXXX1000R&ChemicalId=0007647010&ReportingYear=2018&DocCtrlNum=1318217437514&Opt=0
05452BMXXX1000R GLOBALFOUNDRIES U.S. 2 LLC - VERMONT FACILITY (GLOBALFOUNDRIES US INC) 1000 RIVER ST,
ESSEX JUNCTION,
VT 05452		 Nitric acid 334413: Semiconductor and Related Device Manufacturing 2021 1,483.00 1,212.00 -18.27 Source Reduction: S25: Other process modifications made

 //enviro.epa.gov/enviro/P2_EF_Query.p2_report?FacilityId=05452BMXXX1000R&ChemicalId=0007697372&ReportingYear=2021&DocCtrlNum=1321220439564&Opt=0
05452BMXXX1000R GLOBALFOUNDRIES U.S. 2 LLC - VERMONT FACILITY (GLOBALFOUNDRIES US INC) 1000 RIVER ST,
ESSEX JUNCTION,
VT 05452		 N-Methyl-2-pyrrolidone 334413: Semiconductor and Related Device Manufacturing 2022 3,062.00 2,518.00 -17.77 Source Reduction: S25: Other process modifications made

 //enviro.epa.gov/enviro/P2_EF_Query.p2_report?FacilityId=05452BMXXX1000R&ChemicalId=0000872504&ReportingYear=2022&DocCtrlNum=1322221448842&Opt=0
05452BMXXX1000R GLOBALFOUNDRIES U.S. 2 LLC - VERMONT FACILITY (GLOBALFOUNDRIES US INC) 1000 RIVER ST,
ESSEX JUNCTION,
VT 05452		 Nitrate compounds (water dissociable; reportable only when in aqueous solution) 334413: Semiconductor and Related Device Manufacturing 2023 119,637.75 99,741.10 -16.63 Source Reduction: S25: Other process modifications made

 //enviro.epa.gov/enviro/P2_EF_Query.p2_report?FacilityId=05452BMXXX1000R&ChemicalId=N511&ReportingYear=2023&DocCtrlNum=1323222263016&Opt=0
05452BMXXX1000R GLOBALFOUNDRIES U.S. 2 LLC - VERMONT FACILITY (GLOBALFOUNDRIES US INC) 1000 RIVER ST,
ESSEX JUNCTION,
VT 05452		 Ammonia 334413: Semiconductor and Related Device Manufacturing 2021 32,957.55 27,483.00 -16.61 Source Reduction: S25: Other process modifications made

 //enviro.epa.gov/enviro/P2_EF_Query.p2_report?FacilityId=05452BMXXX1000R&ChemicalId=0007664417&ReportingYear=2021&DocCtrlNum=1321220513131&Opt=0
05452BMXXX1000R GLOBALFOUNDRIES U.S. 2 LLC - VERMONT FACILITY (GLOBALFOUNDRIES US INC) 1000 RIVER ST,
ESSEX JUNCTION,
VT 05452		 Ethylene glycol 334413: Semiconductor and Related Device Manufacturing 2017 941.00 787.79 -16.28 Source Reduction: W42: Substituted raw materials - Substitution of ethylene glycol with propylene glycol: Focus continues on the elimination of ethylene glycol and its replacement with a less toxic chemical, such as propylene glycol, where feasible.

Other Environmental Practices: Waste Treatment - On-site treatment of Hydrofluoric Acid(HF)-Ethylene Glycol(EG) mix waste at the site's Biological Wastewater Treatment Plant (BWTP) eliminated off-site shipments of approximately 70,697 lbs of hazardous waste.On-site treatment of ethylene glycol in the Biological Wastewater Treatment Plant (BWTP). This has reduced the quantity of hazardous waste requiring off-site treatment. 		//enviro.epa.gov/enviro/P2_EF_Query.p2_report?FacilityId=05452BMXXX1000R&ChemicalId=0000107211&ReportingYear=2017&DocCtrlNum=1317216617427&Opt=0
05452BMXXX1000R GLOBALFOUNDRIES U.S. 2 LLC - VERMONT FACILITY (GLOBALFOUNDRIES US INC) 1000 RIVER ST,
ESSEX JUNCTION,
VT 05452		 Nitrate compounds (water dissociable; reportable only when in aqueous solution) 334413: Semiconductor and Related Device Manufacturing 2016 146,060.00 123,235.00 -15.63 Source Reduction: W58: Other process modifications - Nitrate use reduction in Chemical Mechanical Polish (CMP) processes. The goal of the CMP process is to continually remove a metal or oxide film at the wafer surface until a targeted film thickness remains. In both metal tungsten and copper CMP processes, ferric nitrate is a critical component of the slurry because it oxidizes metal to facilitate chemical dissolution and removal. Two projects were completed to reduce CMP chemical usage in 2016. Faster copper process: The best way to lower total slurry use was to substantially reduce CMP processing time. The team focused on optimizing the existing slurry chemistry to dramatically boost the polish rate. The faster process also enabled better manufacturing controls. In significantly dropping the total CMP process time, the team saved 184,000 gallons annually in chemicals from four CMP slurries containing ferric nitrate, hydrogen peroxide, alumina, silica, and various inorganic and organic constituents. This project specifically reduced the use of ferric nitrate by 7,000 lbs which equates to 1,794 lbs of nitrates. Lower flow rate of slurry on the tungsten polish process: A process change was made to lower the flow rate of the slurry used in the tungsten polishing process in CMP. This lower flow process accomplishes the same removal of tungsten. This process change was done on 2 product levels and resulted in a total of 941 lbs of nitrates reduced for 2016.

Other Environmental Practices: Waste Treatment - WASTE TREATMENT: In 2016, the nitrate reduction efforts remained strong with the continued diligence and support of the denitrification steps in the biological treatment sequential batch reactors (SBR's). Ammonia and nitrate loading on the biological wastewater treatment plant increased by 15% and 85% respectively in 2016 compared to 2015. Nitrate treatment efficiency increased by 4% at the biological treatment plant and decreased by 1% at the industrial treatment plant. The nitrates treated in 2016 increased by 20% and the nitrates discharged decreased by 16% as compared to 2015. This equates to lowered releases of 21,967 lbs nitrates in 2016. 		//enviro.epa.gov/enviro/P2_EF_Query.p2_report?FacilityId=05452BMXXX1000R&ChemicalId=N511&ReportingYear=2016&DocCtrlNum=1316215804764&Opt=0
05452BMXXX1000R GLOBALFOUNDRIES U.S. 2 LLC - VERMONT FACILITY (GLOBALFOUNDRIES US INC) 1000 RIVER ST,
ESSEX JUNCTION,
VT 05452		 Nitrate compounds (water dissociable; reportable only when in aqueous solution) 334413: Semiconductor and Related Device Manufacturing 2020 132,943.48 113,928.03 -14.3 Source Reduction: W58: Other process modifications

 //enviro.epa.gov/enviro/P2_EF_Query.p2_report?FacilityId=05452BMXXX1000R&ChemicalId=N511&ReportingYear=2020&DocCtrlNum=1320219327778&Opt=0
05452BMXXX1000R GLOBALFOUNDRIES U.S. 2 LLC - VERMONT FACILITY (GLOBALFOUNDRIES US INC) 1000 RIVER ST,
ESSEX JUNCTION,
VT 05452		 Hydrogen fluoride 334413: Semiconductor and Related Device Manufacturing 2017 4,926.00 4,266.00 -13.4 Source Reduction: W51: Instituted recirculation within a process - At-tool chemical recycle for 49% Hydrofluoric Acid on Clean/Etch tools: After the wafers are sprayed the chemical is routed back to a tank where it is filtered and reused. The chemical is used until the HF in the Nitric acid/HF mixture is spent.
Source Reduction: W58: Other process modifications - Project 1: POST BPSG Chemical Mechanical Polish clean elimination: This step utilized Hydrochloric Acid, Hydrogen peroxide, sulfuric acid, Dilute Hydrofluoric Acid, and Ammonium Hydroxide.Project 2: Post Chemical Mechanical Polish Mc A/B Clean elimination: A clean step post Chemical Mechanical polish process was eliminated. This step utilized Hydrofluoric acid and Ammonium Hydroxide.

 //enviro.epa.gov/enviro/P2_EF_Query.p2_report?FacilityId=05452BMXXX1000R&ChemicalId=0007664393&ReportingYear=2017&DocCtrlNum=1317216334413&Opt=0
05452BMXXX1000R GLOBALFOUNDRIES U.S. 2 LLC - VERMONT FACILITY (GLOBALFOUNDRIES US INC) 1000 RIVER ST,
ESSEX JUNCTION,
VT 05452		 Ethylene glycol 334413: Semiconductor and Related Device Manufacturing 2019 1,211.35 1,060.00 -12.49 Source Reduction: W42: Substituted raw materials

 //enviro.epa.gov/enviro/P2_EF_Query.p2_report?FacilityId=05452BMXXX1000R&ChemicalId=0000107211&ReportingYear=2019&DocCtrlNum=1319218445536&Opt=0
05452BMXXX1000R GLOBALFOUNDRIES U.S. 2 LLC - VERMONT FACILITY (GLOBALFOUNDRIES US INC) 1000 RIVER ST,
ESSEX JUNCTION,
VT 05452		 Sulfuric acid (acid aerosols including mists, vapors, gas, fog, and other airborne forms of any particle size) 334413: Semiconductor and Related Device Manufacturing 2024 712.00 625.00 -12.22 Source Reduction: S25: Other process modifications made - Elimination of manufacturing process step

Source Reduction: Elimination of manufacturing process step 		//enviro.epa.gov/enviro/P2_EF_Query.p2_report?FacilityId=05452BMXXX1000R&ChemicalId=0007664939&ReportingYear=2024&DocCtrlNum=1324223132097&Opt=0
05452BMXXX1000R GLOBALFOUNDRIES U.S. 2 LLC - VERMONT FACILITY (GLOBALFOUNDRIES US INC) 1000 RIVER ST,
ESSEX JUNCTION,
VT 05452		 Nitric acid 334413: Semiconductor and Related Device Manufacturing 2019 1,652.00 1,452.00 -12.11 Source Reduction: W58: Other process modifications

 //enviro.epa.gov/enviro/P2_EF_Query.p2_report?FacilityId=05452BMXXX1000R&ChemicalId=0007697372&ReportingYear=2019&DocCtrlNum=1319218396657&Opt=0
05452BMXXX1000R GLOBALFOUNDRIES U.S. 2 LLC - VERMONT FACILITY (GLOBALFOUNDRIES US INC) 1000 RIVER ST,
ESSEX JUNCTION,
VT 05452		 Hydrochloric acid (acid aerosols including mists, vapors, gas, fog, and other airborne forms of any particle size) 334413: Semiconductor and Related Device Manufacturing 2022 785.00 691.00 -11.97 Source Reduction: S25: Other process modifications made

 //enviro.epa.gov/enviro/P2_EF_Query.p2_report?FacilityId=05452BMXXX1000R&ChemicalId=0007647010&ReportingYear=2022&DocCtrlNum=1322221393453&Opt=0
05452BMXXX1000R GLOBALFOUNDRIES U.S. 2 LLC - VERMONT FACILITY (GLOBALFOUNDRIES US INC) 1000 RIVER ST,
ESSEX JUNCTION,
VT 05452		 Nitrate compounds (water dissociable; reportable only when in aqueous solution) 334413: Semiconductor and Related Device Manufacturing 2018 135,559.35 119,509.67 -11.84 Source Reduction: W58: Other process modifications - Conversion of certain technology levels from a two-step polish to a one Step Tungsten Polish. Qualify KXY grooved pad process for M1 Deintegrated Cu CMP to achieve maximum deployment flexibility and reduce M1 polish time and slurry used. Both these projects resulted in nitrates and other CMP (chemical mechanical polish) source reductions through 2018.

Other Environmental Practices: Waste Treatment - In 2018, the nitrate reduction efforts for the future remained strong with the continued diligence and support of the denitrification steps in the biological treatment sequential batch reactors (SBR's). 		//enviro.epa.gov/enviro/P2_EF_Query.p2_report?FacilityId=05452BMXXX1000R&ChemicalId=N511&ReportingYear=2018&DocCtrlNum=1318217526413&Opt=0
05452BMXXX1000R GLOBALFOUNDRIES U.S. 2 LLC - VERMONT FACILITY (GLOBALFOUNDRIES US INC) 1000 RIVER ST,
ESSEX JUNCTION,
VT 05452		 Ammonia 334413: Semiconductor and Related Device Manufacturing 2020 36,713.00 32,957.55 -10.23 Source Reduction: W58: Other process modifications

 //enviro.epa.gov/enviro/P2_EF_Query.p2_report?FacilityId=05452BMXXX1000R&ChemicalId=0007664417&ReportingYear=2020&DocCtrlNum=1320219344342&Opt=0
05452BMXXX1000R GLOBALFOUNDRIES U.S. 2 LLC - VERMONT FACILITY (GLOBALFOUNDRIES US INC) 1000 RIVER ST,
ESSEX JUNCTION,
VT 05452		 Hydrogen fluoride 334413: Semiconductor and Related Device Manufacturing 2019 4,511.00 4,127.00 -8.51 Source Reduction: W58: Other process modifications

 //enviro.epa.gov/enviro/P2_EF_Query.p2_report?FacilityId=05452BMXXX1000R&ChemicalId=0007664393&ReportingYear=2019&DocCtrlNum=1319218445548&Opt=0
05452BMXXX1000R GLOBALFOUNDRIES U.S. 2 LLC - VERMONT FACILITY (GLOBALFOUNDRIES US INC) 1000 RIVER ST,
ESSEX JUNCTION,
VT 05452		 Hydrogen fluoride 334413: Semiconductor and Related Device Manufacturing 2016 5,284.00 4,926.00 -6.78 Source Reduction: W51: Instituted recirculation within a process - At tool recycle capability is utilized. Chemical is used and then routed back to a tank where it is filtered and reused until the mixture is spent. In 2016, approximately 75,000 pounds of 49% hydrofluoric acid was recycled at the tools.
Source Reduction: W58: Other process modifications - In 2016, the surface prep team worked on optimizing multiple chemical cleaning steps, and where technically feasible combining them into one chemical cleaning step, thus resulting in process optimizations and associated chemical savings. The chemical savings resulting from multiple process optimizations in 2016 were as follows: Ammonium Hydroxide 827 gals, Hydrogen Peroxide 3537 gals, Hydrochloric Acid 672 gals, Isopropyl Alcohol 8818 gals, Sulfuric Acid 5683 gals, Hot DI 694,230 gals, Cold DI water 390,512 gals, Hydrofluoric Acid 41 gals
Source Reduction: W78: Other surface preparation and finishing modifications - Product Batch Size Optimizations for optimized chemical use: In 2015, the surface prep team began evaluation of batch size optimizations on certain manufacturing tools. The goal of this project was to optimize batch size so more product could be run using the same amount of chemical. The idea was implemented in 2016. The chemicals optimized included hydrofluoric acid, sulfuric acid, hydrogen peroxide, hydrochloric acid, and ammonium hydroxide. Chemical savings from batching were 13% on one tool set and 24 % on the other tool set.

 //enviro.epa.gov/enviro/P2_EF_Query.p2_report?FacilityId=05452BMXXX1000R&ChemicalId=0007664393&ReportingYear=2016&DocCtrlNum=1316215701943&Opt=0
05452BMXXX1000R GLOBALFOUNDRIES U.S. 2 LLC - VERMONT FACILITY (GLOBALFOUNDRIES US INC) 1000 RIVER ST,
ESSEX JUNCTION,
VT 05452		 Hydrogen fluoride 334413: Semiconductor and Related Device Manufacturing 2022 2,818.00 2,655.00 -5.78 Source Reduction: S25: Other process modifications made

 //enviro.epa.gov/enviro/P2_EF_Query.p2_report?FacilityId=05452BMXXX1000R&ChemicalId=0007664393&ReportingYear=2022&DocCtrlNum=1322221448830&Opt=0
05452BMXXX1000R GLOBALFOUNDRIES U.S. 2 LLC - VERMONT FACILITY (GLOBALFOUNDRIES US INC) 1000 RIVER ST,
ESSEX JUNCTION,
VT 05452		 Nitric acid 334413: Semiconductor and Related Device Manufacturing 2022 1,212.00 1,143.00 -5.69 Source Reduction: S25: Other process modifications made

 //enviro.epa.gov/enviro/P2_EF_Query.p2_report?FacilityId=05452BMXXX1000R&ChemicalId=0007697372&ReportingYear=2022&DocCtrlNum=1322221410208&Opt=0
05452BMXXX1000R GLOBALFOUNDRIES U.S. 2 LLC - VERMONT FACILITY (GLOBALFOUNDRIES US INC) 1000 RIVER ST,
ESSEX JUNCTION,
VT 05452		 Ethylene glycol 334413: Semiconductor and Related Device Manufacturing 2022 1,224.00 1,165.00 -4.82 Source Reduction: S25: Other process modifications made

 //enviro.epa.gov/enviro/P2_EF_Query.p2_report?FacilityId=05452BMXXX1000R&ChemicalId=0000107211&ReportingYear=2022&DocCtrlNum=1322221447030&Opt=0
05452BMXXX1000R GLOBALFOUNDRIES U.S. 2 LLC - VERMONT FACILITY (GLOBALFOUNDRIES US INC) 1000 RIVER ST,
ESSEX JUNCTION,
VT 05452		 Hydrogen fluoride 334413: Semiconductor and Related Device Manufacturing 2024 2,731.00 2,604.00 -4.65 Source Reduction: S25: Other process modifications made - Elimination of manufacturing process step

Source Reduction: Elimination of manufacturing process step 		//enviro.epa.gov/enviro/P2_EF_Query.p2_report?FacilityId=05452BMXXX1000R&ChemicalId=0007664393&ReportingYear=2024&DocCtrlNum=1324223132034&Opt=0
05452BMXXX1000R GLOBALFOUNDRIES U.S. 2 LLC - VERMONT FACILITY (GLOBALFOUNDRIES US INC) 1000 RIVER ST,
ESSEX JUNCTION,
VT 05452		 Hydrogen fluoride 334413: Semiconductor and Related Device Manufacturing 2021 2,948.00 2,818.00 -4.41 Source Reduction: S25: Other process modifications made

 //enviro.epa.gov/enviro/P2_EF_Query.p2_report?FacilityId=05452BMXXX1000R&ChemicalId=0007664393&ReportingYear=2021&DocCtrlNum=1321220460063&Opt=0
05452BMXXX1000R GLOBALFOUNDRIES U.S. 2 LLC - VERMONT FACILITY (GLOBALFOUNDRIES US INC) 1000 RIVER ST,
ESSEX JUNCTION,
VT 05452		 Ozone 334413: Semiconductor and Related Device Manufacturing 2021 49.00 47.00 -4.08 Source Reduction: S25: Other process modifications made

 //enviro.epa.gov/enviro/P2_EF_Query.p2_report?FacilityId=05452BMXXX1000R&ChemicalId=0010028156&ReportingYear=2021&DocCtrlNum=1321220439537&Opt=0
05452BMXXX1000R GLOBALFOUNDRIES U.S. 2 LLC - VERMONT FACILITY (GLOBALFOUNDRIES US INC) 1000 RIVER ST,
ESSEX JUNCTION,
VT 05452		 Nitric acid 334413: Semiconductor and Related Device Manufacturing 2023 1,143.00 1,108.00 -3.06 Source Reduction: S25: Other process modifications made

 //enviro.epa.gov/enviro/P2_EF_Query.p2_report?FacilityId=05452BMXXX1000R&ChemicalId=0007697372&ReportingYear=2023&DocCtrlNum=1323222305195&Opt=0
05452BMXXX1000R GLOBALFOUNDRIES U.S. 2 LLC - VERMONT FACILITY (GLOBALFOUNDRIES US INC) 1000 RIVER ST,
ESSEX JUNCTION,
VT 05452		 Nitrate compounds (water dissociable; reportable only when in aqueous solution) 334413: Semiconductor and Related Device Manufacturing 2022 123,028.42 119,637.75 -2.76 Source Reduction: S25: Other process modifications made

 //enviro.epa.gov/enviro/P2_EF_Query.p2_report?FacilityId=05452BMXXX1000R&ChemicalId=N511&ReportingYear=2022&DocCtrlNum=1322221394164&Opt=0
05452BMXXX1000R GLOBALFOUNDRIES U.S. 2 LLC - VERMONT FACILITY (GLOBALFOUNDRIES US INC) 1000 RIVER ST,
ESSEX JUNCTION,
VT 05452		 Ozone 334413: Semiconductor and Related Device Manufacturing 2020 50.00 49.00 -2 Source Reduction: W52: Modified equipment, layout, or piping

 //enviro.epa.gov/enviro/P2_EF_Query.p2_report?FacilityId=05452BMXXX1000R&ChemicalId=0010028156&ReportingYear=2020&DocCtrlNum=1320219327792&Opt=0
05452BMXXX1000R GLOBALFOUNDRIES U.S. 2 LLC - VERMONT FACILITY (GLOBALFOUNDRIES US INC) 1000 RIVER ST,
ESSEX JUNCTION,
VT 05452		 Fluorine 334413: Semiconductor and Related Device Manufacturing 2019 1,602.00 1,602.00 0 Source Reduction: W58: Other process modifications

 //enviro.epa.gov/enviro/P2_EF_Query.p2_report?FacilityId=05452BMXXX1000R&ChemicalId=0007782414&ReportingYear=2019&DocCtrlNum=1319218396620&Opt=0
05452BMXXX1000R GLOBALFOUNDRIES U.S. 2 LLC - VERMONT FACILITY (GLOBALFOUNDRIES US INC) 1000 RIVER ST,
ESSEX JUNCTION,
VT 05452		 Fluorine 334413: Semiconductor and Related Device Manufacturing 2022 1,022.00 1,022.00 0 Source Reduction: S25: Other process modifications made

 //enviro.epa.gov/enviro/P2_EF_Query.p2_report?FacilityId=05452BMXXX1000R&ChemicalId=0007782414&ReportingYear=2022&DocCtrlNum=1322221336845&Opt=0
05452BMXXX1000R GLOBALFOUNDRIES U.S. 2 LLC - VERMONT FACILITY (GLOBALFOUNDRIES US INC) 1000 RIVER ST,
ESSEX JUNCTION,
VT 05452		 Fluorine 334413: Semiconductor and Related Device Manufacturing 2023 1,022.00 1,022.00 0 Source Reduction: S25: Other process modifications made

 //enviro.epa.gov/enviro/P2_EF_Query.p2_report?FacilityId=05452BMXXX1000R&ChemicalId=0007782414&ReportingYear=2023&DocCtrlNum=1323222263509&Opt=0
05452BMXXX1000R GLOBALFOUNDRIES U.S. 2 LLC - VERMONT FACILITY (GLOBALFOUNDRIES US INC) 1000 RIVER ST,
ESSEX JUNCTION,
VT 05452		 Ozone 334413: Semiconductor and Related Device Manufacturing 2017 0 0 0 Source Reduction: W52: Modified equipment, layout, or piping - Utilization of a point-of-use Ozone destruct unit strategy was continued in 2017 by installing at-tool ozone destruct units, where feasible, and optimizing treatment.

 //enviro.epa.gov/enviro/P2_EF_Query.p2_report?FacilityId=05452BMXXX1000R&ChemicalId=0010028156&ReportingYear=2017&DocCtrlNum=1317216334680&Opt=0
05452BMXXX1000R GLOBALFOUNDRIES U.S. 2 LLC - VERMONT FACILITY (GLOBALFOUNDRIES US INC) 1000 RIVER ST,
ESSEX JUNCTION,
VT 05452		 Ozone 334413: Semiconductor and Related Device Manufacturing 2018 0 0 0 Source Reduction: W52: Modified equipment, layout, or piping - Utilization of a point-of-use Ozone destruct unit strategy was continued in 2018 by installing at-tool ozone destruct units, where feasible, and optimizing treatment.

 //enviro.epa.gov/enviro/P2_EF_Query.p2_report?FacilityId=05452BMXXX1000R&ChemicalId=0010028156&ReportingYear=2018&DocCtrlNum=1318217437540&Opt=0
05452BMXXX1000R GLOBALFOUNDRIES U.S. 2 LLC - VERMONT FACILITY (GLOBALFOUNDRIES US INC) 1000 RIVER ST,
ESSEX JUNCTION,
VT 05452		 Nitric acid 334413: Semiconductor and Related Device Manufacturing 2017 1,376.00 1,378.00 .15 Source Reduction: W51: Instituted recirculation within a process - At-tool chemical recycle for the Nitric Acid/HF Mixture. The used chemical mixture is routed back to a tank where it is filtered and reused until the HF in the Nitric acid/HF mixture is spent.
Source Reduction: W58: Other process modifications - Platinum Silicide Cleans alternate chemistry evaluations were conducted that would eliminate the use of Aqua Regia (composed of Nitric and Hydrochloric acid) in this process. Evaluation promising and full implementation planned.Technical feasibility evaluations The alternate chemistry has shown to have worked. Full implementation is planned in 2018.
Source Reduction: W71: Other cleaning and degreasing modifications - Cobalt Silicide Cleans Elimination combines 2-step (FSI and Steag) clean process to 1-step Zeta process. The process was implemented in Sept 2016 with 2017 full-year savings of Nitric Acid (1830 gal), Hydrogen Peroxide (20,277 gal), and Hydrochloric Acid (789 gal).

 //enviro.epa.gov/enviro/P2_EF_Query.p2_report?FacilityId=05452BMXXX1000R&ChemicalId=0007697372&ReportingYear=2017&DocCtrlNum=1317216336899&Opt=0
05452BMXXX1000R GLOBALFOUNDRIES U.S. 2 LLC - VERMONT FACILITY (GLOBALFOUNDRIES US INC) 1000 RIVER ST,
ESSEX JUNCTION,
VT 05452		 Fluorine 334413: Semiconductor and Related Device Manufacturing 2020 1,602.00 1,606.00 .25 Source Reduction: W58: Other process modifications

 //enviro.epa.gov/enviro/P2_EF_Query.p2_report?FacilityId=05452BMXXX1000R&ChemicalId=0007782414&ReportingYear=2020&DocCtrlNum=1320219327739&Opt=0
05452BMXXX1000R GLOBALFOUNDRIES U.S. 2 LLC - VERMONT FACILITY (GLOBALFOUNDRIES US INC) 1000 RIVER ST,
ESSEX JUNCTION,
VT 05452		 N-Methyl-2-pyrrolidone 334413: Semiconductor and Related Device Manufacturing 2018 853.84 857.63 .44 Other Environmental Practices: Recycling - N- Methyl-2-Pyrrolidone (NMP) WASTE RECYCLE. A large portion of NMP waste was recycled through solvent recovery off-site.
Other Environmental Practices: Energy Recovery - N- Methyl-2-Pyrrolidone (NMP) WASTE RECLAMATION. A large portion of NMP waste was reclaimed and fuel blended for energy recovery. 		//enviro.epa.gov/enviro/P2_EF_Query.p2_report?FacilityId=05452BMXXX1000R&ChemicalId=0000872504&ReportingYear=2018&DocCtrlNum=1318217526401&Opt=0
05452BMXXX1000R GLOBALFOUNDRIES U.S. 2 LLC - VERMONT FACILITY (GLOBALFOUNDRIES US INC) 1000 RIVER ST,
ESSEX JUNCTION,
VT 05452		 Nitric acid 334413: Semiconductor and Related Device Manufacturing 2020 1,452.00 1,483.00 2.13 Source Reduction: W58: Other process modifications

 //enviro.epa.gov/enviro/P2_EF_Query.p2_report?FacilityId=05452BMXXX1000R&ChemicalId=0007697372&ReportingYear=2020&DocCtrlNum=1320219327780&Opt=0
05452BMXXX1000R GLOBALFOUNDRIES U.S. 2 LLC - VERMONT FACILITY (GLOBALFOUNDRIES US INC) 1000 RIVER ST,
ESSEX JUNCTION,
VT 05452		 Hydrochloric acid (acid aerosols including mists, vapors, gas, fog, and other airborne forms of any particle size) 334413: Semiconductor and Related Device Manufacturing 2020 705.00 720.00 2.13 Source Reduction: W58: Other process modifications

 //enviro.epa.gov/enviro/P2_EF_Query.p2_report?FacilityId=05452BMXXX1000R&ChemicalId=0007647010&ReportingYear=2020&DocCtrlNum=1320219327741&Opt=0
05452BMXXX1000R GLOBALFOUNDRIES U.S. 2 LLC - VERMONT FACILITY (GLOBALFOUNDRIES US INC) 1000 RIVER ST,
ESSEX JUNCTION,
VT 05452		 Nitric acid 334413: Semiconductor and Related Device Manufacturing 2016 1,344.00 1,376.00 2.38 Source Reduction: W51: Instituted recirculation within a process - At tool recycle capability is utilized. Chemical is used and then routed back to a tank where it is filtered and reused until the mixture is spent. In 2016, 33,899 pounds of nitric acid was recycled at the tools.
Source Reduction: W58: Other process modifications - In 2016, there was a reduction in the use of Aqua Regia (a chemical that constitutes Nitric Acid, Hydrochloric acid and water) causing a decrease in the use of nitric acid and hydrochloric acid in this process. This was accomplished by reduced bath exchange and Increased batching of wafers. This change was implemented in May 2016. The chemical savings in 2016 were as follows: 2,963 gals of Hydrochloric Acid, 339 gals of Nitric Acid.
Source Reduction: W71: Other cleaning and degreasing modifications - Cobalt Silicide Cleans Elimination: Combine 2-step clean process to 1-step Zeta process. Eliminates the use of Nitric Acid and Hydrogen Peroxide in this process. The process was implemented in September 2016. 2016 chemical savings are as follows: Nitric Acid 458 gals, Hydrogen Peroxide 5,069 gals, Hydrochloric Acid 197 gals

 //enviro.epa.gov/enviro/P2_EF_Query.p2_report?FacilityId=05452BMXXX1000R&ChemicalId=0007697372&ReportingYear=2016&DocCtrlNum=1316215701970&Opt=0
05452BMXXX1000R GLOBALFOUNDRIES U.S. 2 LLC - VERMONT FACILITY (GLOBALFOUNDRIES US INC) 1000 RIVER ST,
ESSEX JUNCTION,
VT 05452		 Hydrogen fluoride 334413: Semiconductor and Related Device Manufacturing 2023 2,655.00 2,731.00 2.86 Source Reduction: S25: Other process modifications made

 //enviro.epa.gov/enviro/P2_EF_Query.p2_report?FacilityId=05452BMXXX1000R&ChemicalId=0007664393&ReportingYear=2023&DocCtrlNum=1323222294934&Opt=0
05452BMXXX1000R GLOBALFOUNDRIES U.S. 2 LLC - VERMONT FACILITY (GLOBALFOUNDRIES US INC) 1000 RIVER ST,
ESSEX JUNCTION,
VT 05452		 Sulfuric acid (acid aerosols including mists, vapors, gas, fog, and other airborne forms of any particle size) 334413: Semiconductor and Related Device Manufacturing 2021 811.00 841.00 3.7 Source Reduction: S25: Other process modifications made

 //enviro.epa.gov/enviro/P2_EF_Query.p2_report?FacilityId=05452BMXXX1000R&ChemicalId=0007664939&ReportingYear=2021&DocCtrlNum=1321220439549&Opt=0
05452BMXXX1000R GLOBALFOUNDRIES U.S. 2 LLC - VERMONT FACILITY (GLOBALFOUNDRIES US INC) 1000 RIVER ST,
ESSEX JUNCTION,
VT 05452		 Ethylene glycol 334413: Semiconductor and Related Device Manufacturing 2016 900.00 941.00 4.56 Source Reduction: W42: Substituted raw materials - Due to the characteristics of ethylene glycol, focus continues on the elimination of ethylene glycol and its replacement with a less toxic chemical, such as propylene glycol. The GLOBALFOUNDRIES U.S. 2 LLC Chemical Management Team conducts Environmental Impact Assessments on all new equipment and reviews new uses of ethylene glycol. Where feasible, ethylene glycol use is substituted with propylene glycol.

Other Environmental Practices: Waste Treatment - WASTE TREATMENT: In addition to source reduction activities, the following on-site waste treatment activities occurred in 2016 reducing the need for off-site shipment and disposal of waste ethylene glycol solutions: (1) In 2016, the on-site treatment of hydrofluoric acid/ethylene glycol waste at the facility's Biological Wastewater Treatment Plant (BWTP) eliminated off-site shipments of approximately 91,685 pounds of hazardous waste. (2) In 2016, approximately 16,555 pounds of waste glycol solutions (mixed ethylene and propylene glycol) were treated on-site. 		//enviro.epa.gov/enviro/P2_EF_Query.p2_report?FacilityId=05452BMXXX1000R&ChemicalId=0000107211&ReportingYear=2016&DocCtrlNum=1316215701929&Opt=0
05452BMXXX1000R GLOBALFOUNDRIES U.S. 2 LLC - VERMONT FACILITY (GLOBALFOUNDRIES US INC) 1000 RIVER ST,
ESSEX JUNCTION,
VT 05452		 Sulfuric acid (acid aerosols including mists, vapors, gas, fog, and other airborne forms of any particle size) 334413: Semiconductor and Related Device Manufacturing 2017 538.00 563.00 4.65 Source Reduction: W58: Other process modifications - Chemical optimizations on the FSI tools (Hydrochloric Acid, Sulfuric Acid and Hydrogen Peroxide). A newer process was qualified on the FSI spray tools that runs a reduced process recipe time. Full technical feasibility assessment was completed in 2017 and currently the project is in a 30% phase in on certain high volume technologies.

 //enviro.epa.gov/enviro/P2_EF_Query.p2_report?FacilityId=05452BMXXX1000R&ChemicalId=0007664939&ReportingYear=2017&DocCtrlNum=1317216645655&Opt=0
05452BMXXX1000R GLOBALFOUNDRIES U.S. 2 LLC - VERMONT FACILITY (GLOBALFOUNDRIES US INC) 1000 RIVER ST,
ESSEX JUNCTION,
VT 05452		 Sulfuric acid (acid aerosols including mists, vapors, gas, fog, and other airborne forms of any particle size) 334413: Semiconductor and Related Device Manufacturing 2020 768.00 811.00 5.6 Source Reduction: W58: Other process modifications

 //enviro.epa.gov/enviro/P2_EF_Query.p2_report?FacilityId=05452BMXXX1000R&ChemicalId=0007664939&ReportingYear=2020&DocCtrlNum=1320219327804&Opt=0
05452BMXXX1000R GLOBALFOUNDRIES U.S. 2 LLC - VERMONT FACILITY (GLOBALFOUNDRIES US INC) 1000 RIVER ST,
ESSEX JUNCTION,
VT 05452		 Hydrogen fluoride 334413: Semiconductor and Related Device Manufacturing 2018 4,266.00 4,511.00 5.74 Source Reduction: W51: Instituted recirculation within a process - At-tool chemical recycle for 49% Hydrofluoric Acid on Clean/Etch tools: After the wafers are sprayed the chemical is routed back to a tank where it is filtered and reused. The chemical is used until the HF in the Nitric acid/HF mixture is spent.
Source Reduction: W58: Other process modifications - POST BPSG Chemical Mechanical Polish clean elimination: This step utilized Hydrochloric Acid, Hydrogen peroxide, sulfuric acid, Dilute Hydrofluoric Acid, and Ammonium Hydroxide.

 //enviro.epa.gov/enviro/P2_EF_Query.p2_report?FacilityId=05452BMXXX1000R&ChemicalId=0007664393&ReportingYear=2018&DocCtrlNum=1318217437526&Opt=0
05452BMXXX1000R GLOBALFOUNDRIES U.S. 2 LLC - VERMONT FACILITY (GLOBALFOUNDRIES US INC) 1000 RIVER ST,
ESSEX JUNCTION,
VT 05452		 Hydrochloric acid (acid aerosols including mists, vapors, gas, fog, and other airborne forms of any particle size) 334413: Semiconductor and Related Device Manufacturing 2024 761.00 806.00 5.91 Source Reduction: S25: Other process modifications made

Methods to Identify SR Opportunities: T04 : PARTICIPATIVE TEAM MANAGEMENT - Elimination of manufacturing process step. 		//enviro.epa.gov/enviro/P2_EF_Query.p2_report?FacilityId=05452BMXXX1000R&ChemicalId=0007647010&ReportingYear=2024&DocCtrlNum=1324223132073&Opt=0
05452BMXXX1000R GLOBALFOUNDRIES U.S. 2 LLC - VERMONT FACILITY (GLOBALFOUNDRIES US INC) 1000 RIVER ST,
ESSEX JUNCTION,
VT 05452		 Nitrate compounds (water dissociable; reportable only when in aqueous solution) 334413: Semiconductor and Related Device Manufacturing 2021 113,928.03 123,028.42 7.99 Source Reduction: S25: Other process modifications made

 //enviro.epa.gov/enviro/P2_EF_Query.p2_report?FacilityId=05452BMXXX1000R&ChemicalId=N511&ReportingYear=2021&DocCtrlNum=1321220439525&Opt=0
05452BMXXX1000R GLOBALFOUNDRIES U.S. 2 LLC - VERMONT FACILITY (GLOBALFOUNDRIES US INC) 1000 RIVER ST,
ESSEX JUNCTION,
VT 05452		 Hydrochloric acid (acid aerosols including mists, vapors, gas, fog, and other airborne forms of any particle size) 334413: Semiconductor and Related Device Manufacturing 2017 1,099.00 1,188.00 8.1 Source Reduction: W42: Substituted raw materials - Mask House project for Hydrochloric Acid (HCl) and Ammonium Hydroxide reduction by replacing the chromium wet etch with a dry etch. The dry chromium etching process, uses a chlorine and oxygen plasma to remove the exposed chromium eliminating the use of Ammonia, Sulfuric, and Hydrochloric chemicals in these steps.
Source Reduction: W58: Other process modifications - Project 1: POST BPSG Chemical Mechanical Polish clean elimination: This step utilized Hydrochloric Acid, Hydrogen peroxide, sulfuric acid, Dilute Hydrofluoric Acid, and Ammonium Hydroxide.Project 2: Post Chemical Mechanical Polish Mc A/B Clean elimination: A clean step post Chemical Mechanical polish process was eliminated. This step utilized Hydrofluoric acid and Ammonium Hydroxide.Project 3: Chemical optimizations on the FSI tools (Hydrochloric Acid, Sulfuric Acid and Hydrogen Peroxide). A newer process was qualified on the FSI spray tools that runs a reduced process recipe time. Full technical feasibility assessment was completed in 2017 and currently the project is in a 30% phase in on certain high volume technologies.

 //enviro.epa.gov/enviro/P2_EF_Query.p2_report?FacilityId=05452BMXXX1000R&ChemicalId=0007647010&ReportingYear=2017&DocCtrlNum=1317216341798&Opt=0
05452BMXXX1000R GLOBALFOUNDRIES U.S. 2 LLC - VERMONT FACILITY (GLOBALFOUNDRIES US INC) 1000 RIVER ST,
ESSEX JUNCTION,
VT 05452		 Ozone 334413: Semiconductor and Related Device Manufacturing 2022 47.00 51.00 8.51 Source Reduction: S25: Other process modifications made

 //enviro.epa.gov/enviro/P2_EF_Query.p2_report?FacilityId=05452BMXXX1000R&ChemicalId=0010028156&ReportingYear=2022&DocCtrlNum=1322221336858&Opt=0
05452BMXXX1000R GLOBALFOUNDRIES U.S. 2 LLC - VERMONT FACILITY (GLOBALFOUNDRIES US INC) 1000 RIVER ST,
ESSEX JUNCTION,
VT 05452		 Hydrochloric acid (acid aerosols including mists, vapors, gas, fog, and other airborne forms of any particle size) 334413: Semiconductor and Related Device Manufacturing 2021 720.00 785.00 9.03 Source Reduction: S25: Other process modifications made

 //enviro.epa.gov/enviro/P2_EF_Query.p2_report?FacilityId=05452BMXXX1000R&ChemicalId=0007647010&ReportingYear=2021&DocCtrlNum=1321220439552&Opt=0
05452BMXXX1000R GLOBALFOUNDRIES U.S. 2 LLC - VERMONT FACILITY (GLOBALFOUNDRIES US INC) 1000 RIVER ST,
ESSEX JUNCTION,
VT 05452		 Nitrate compounds (water dissociable; reportable only when in aqueous solution) 334413: Semiconductor and Related Device Manufacturing 2017 123,235.00 135,559.35 10 Source Reduction: W58: Other process modifications - Project Name: Conversion of certain technology levels from a two-step polish to a one Step Tungsten Polish Project Name: Qualify KXY grooved pad process for M1 Deintegrated Cu CMP to achieve maximum deployment flexibility and reduce M1 polish time and slurry used. Both these projects resulted in nitrates and other CMP (chemical mechanical polish) source reductions through 2018.

Other Environmental Practices: Waste Treatment - In 2017, the nitrate reduction efforts for the future remained strong with the continued diligence and support of the denitrification steps in the biological treatment sequential batch reactors (SBR's). 		//enviro.epa.gov/enviro/P2_EF_Query.p2_report?FacilityId=05452BMXXX1000R&ChemicalId=N511&ReportingYear=2017&DocCtrlNum=1317216341952&Opt=0
05452BMXXX1000R GLOBALFOUNDRIES U.S. 2 LLC - VERMONT FACILITY (GLOBALFOUNDRIES US INC) 1000 RIVER ST,
ESSEX JUNCTION,
VT 05452		 Hydrochloric acid (acid aerosols including mists, vapors, gas, fog, and other airborne forms of any particle size) 334413: Semiconductor and Related Device Manufacturing 2023 691.00 761.00 10.13 Source Reduction: S25: Other process modifications made

 //enviro.epa.gov/enviro/P2_EF_Query.p2_report?FacilityId=05452BMXXX1000R&ChemicalId=0007647010&ReportingYear=2023&DocCtrlNum=1323222263497&Opt=0
05452BMXXX1000R GLOBALFOUNDRIES U.S. 2 LLC - VERMONT FACILITY (GLOBALFOUNDRIES US INC) 1000 RIVER ST,
ESSEX JUNCTION,
VT 05452		 Sulfuric acid (acid aerosols including mists, vapors, gas, fog, and other airborne forms of any particle size) 334413: Semiconductor and Related Device Manufacturing 2019 696.11 768.00 10.33 Source Reduction: W58: Other process modifications

 //enviro.epa.gov/enviro/P2_EF_Query.p2_report?FacilityId=05452BMXXX1000R&ChemicalId=0007664939&ReportingYear=2019&DocCtrlNum=1319218396671&Opt=0
05452BMXXX1000R GLOBALFOUNDRIES U.S. 2 LLC - VERMONT FACILITY (GLOBALFOUNDRIES US INC) 1000 RIVER ST,
ESSEX JUNCTION,
VT 05452		 Nitrate compounds (water dissociable; reportable only when in aqueous solution) 334413: Semiconductor and Related Device Manufacturing 2019 119,509.67 132,943.48 11.24 Source Reduction: W58: Other process modifications

 //enviro.epa.gov/enviro/P2_EF_Query.p2_report?FacilityId=05452BMXXX1000R&ChemicalId=N511&ReportingYear=2019&DocCtrlNum=1319218396644&Opt=0
05452BMXXX1000R GLOBALFOUNDRIES U.S. 2 LLC - VERMONT FACILITY (GLOBALFOUNDRIES US INC) 1000 RIVER ST,
ESSEX JUNCTION,
VT 05452		 Sulfuric acid (acid aerosols including mists, vapors, gas, fog, and other airborne forms of any particle size) 334413: Semiconductor and Related Device Manufacturing 2023 607.00 712.00 17.3 Source Reduction: S25: Other process modifications made

 //enviro.epa.gov/enviro/P2_EF_Query.p2_report?FacilityId=05452BMXXX1000R&ChemicalId=0007664939&ReportingYear=2023&DocCtrlNum=1323222263485&Opt=0
05452BMXXX1000R GLOBALFOUNDRIES U.S. 2 LLC - VERMONT FACILITY (GLOBALFOUNDRIES US INC) 1000 RIVER ST,
ESSEX JUNCTION,
VT 05452		 Nitric acid 334413: Semiconductor and Related Device Manufacturing 2018 1,378.00 1,652.00 19.88 Source Reduction: W51: Instituted recirculation within a process - Continued work on at-tool chemical recycle for the Nitric Acid/HF Mixture. The used chemical mixture is routed back to a tank where it is filtered and reused until the HF in the Nitric acid/HF mixture is spent.
Source Reduction: W58: Other process modifications - Platinum Silicide Cleans alternate chemistry evaluations were conducted that would eliminate the use of Aqua Regia (composed of Nitric and Hydrochloric acid) in this process. The alternate chemistry has been shown to work. Full qualification was completed in 2018 and conversion to the new process is planned for 2019.

 //enviro.epa.gov/enviro/P2_EF_Query.p2_report?FacilityId=05452BMXXX1000R&ChemicalId=0007697372&ReportingYear=2018&DocCtrlNum=1318217437538&Opt=0
05452BMXXX1000R GLOBALFOUNDRIES U.S. 2 LLC - VERMONT FACILITY (GLOBALFOUNDRIES US INC) 1000 RIVER ST,
ESSEX JUNCTION,
VT 05452		 Hydrochloric acid (acid aerosols including mists, vapors, gas, fog, and other airborne forms of any particle size) 334413: Semiconductor and Related Device Manufacturing 2016 912.00 1,099.00 20.5 Source Reduction: W42: Substituted raw materials - Migrated some of the wet etch processes that use hydrochloric acid in the mask manufacturing line to a dry etch process. In 2015, full qualification and 25 % of this conversion were completed. The full implementation occurred in 2016. This resulted in the following chemical savings: 836 gals of PEH-3 (Hydrochloric Acid containing chemistry), 656 gals of CR-7 etchant, 435 gals of sulfuric acid
Source Reduction: W58: Other process modifications - In 2016, the surface prep team worked on optimizing multiple chemical cleaning steps, and where technically feasible combining them into one chemical cleaning step, thus resulting in process optimizations and associated chemical savings. The chemical savings resulting from multiple process optimizations in 2016 were as follows: Ammonium Hydroxide 827 gals, Hydrogen Peroxide 3537 gals, Hydrochloric Acid 672 gals, Isopropyl Alcohol 8818 gals, Sulfuric Acid 5683 gals, Hot DI 694,230 gals, Cold DI water 390,512 gals, Hydrofluoric Acid 41 gals
Source Reduction: W78: Other surface preparation and finishing modifications - Product Batch Size Optimizations for optimized chemical use: In 2015, the surface prep team began evaluation of batch size optimizations on certain manufacturing tools. The goal of this project was to optimize batch size so more product could be run using the same amount of chemical. The idea was implemented in 2016. The chemicals optimized included hydrofluoric acid, sulfuric acid, hydrogen peroxide, hydrochloric acid, and ammonium hydroxide. Chemical savings from batching were 13% on one tool set and 24 % on the other tool set.

 //enviro.epa.gov/enviro/P2_EF_Query.p2_report?FacilityId=05452BMXXX1000R&ChemicalId=0007647010&ReportingYear=2016&DocCtrlNum=1316215701931&Opt=0
05452BMXXX1000R GLOBALFOUNDRIES U.S. 2 LLC - VERMONT FACILITY (GLOBALFOUNDRIES US INC) 1000 RIVER ST,
ESSEX JUNCTION,
VT 05452		 N-Methyl-2-pyrrolidone 334413: Semiconductor and Related Device Manufacturing 2024 1,718.00 2,073.00 20.66 Source Reduction: S22: Instituted recirculation within a process - Chemical reuse at the tool level.

Source Reduction: Chemical reuse at the tool level. 		//enviro.epa.gov/enviro/P2_EF_Query.p2_report?FacilityId=05452BMXXX1000R&ChemicalId=0000872504&ReportingYear=2024&DocCtrlNum=1324223132109&Opt=0
05452BMXXX1000R GLOBALFOUNDRIES U.S. 2 LLC - VERMONT FACILITY (GLOBALFOUNDRIES US INC) 1000 RIVER ST,
ESSEX JUNCTION,
VT 05452		 Sulfuric acid (acid aerosols including mists, vapors, gas, fog, and other airborne forms of any particle size) 334413: Semiconductor and Related Device Manufacturing 2018 563.00 696.11 23.64 Source Reduction: W58: Other process modifications - Chemical optimizations on the FSI tools (Hydrochloric Acid, Sulfuric Acid and Hydrogen Peroxide). A newer process was qualified on the FSI spray tools that runs a reduced process recipe time. Full technical feasibility assessments were completed and the project is fully implemented on certain high volume technologies.

 //enviro.epa.gov/enviro/P2_EF_Query.p2_report?FacilityId=05452BMXXX1000R&ChemicalId=0007664939&ReportingYear=2018&DocCtrlNum=1318217437553&Opt=0
05452BMXXX1000R GLOBALFOUNDRIES U.S. 2 LLC - VERMONT FACILITY (GLOBALFOUNDRIES US INC) 1000 RIVER ST,
ESSEX JUNCTION,
VT 05452		 Ammonia 334413: Semiconductor and Related Device Manufacturing 2022 27,483.00 38,431.00 39.84 Source Reduction: S25: Other process modifications made

 //enviro.epa.gov/enviro/P2_EF_Query.p2_report?FacilityId=05452BMXXX1000R&ChemicalId=0007664417&ReportingYear=2022&DocCtrlNum=1322221448828&Opt=0
05452BMXXX1000R GLOBALFOUNDRIES U.S. 2 LLC - VERMONT FACILITY (GLOBALFOUNDRIES US INC) 1000 RIVER ST,
ESSEX JUNCTION,
VT 05452		 N-Methyl-2-pyrrolidone 334413: Semiconductor and Related Device Manufacturing 2021 2,161.00 3,062.00 41.69 Source Reduction: S25: Other process modifications made

 //enviro.epa.gov/enviro/P2_EF_Query.p2_report?FacilityId=05452BMXXX1000R&ChemicalId=0000872504&ReportingYear=2021&DocCtrlNum=1321220490813&Opt=0
05452BMXXX1000R GLOBALFOUNDRIES U.S. 2 LLC - VERMONT FACILITY (GLOBALFOUNDRIES US INC) 1000 RIVER ST,
ESSEX JUNCTION,
VT 05452		 N-Methyl-2-pyrrolidone 334413: Semiconductor and Related Device Manufacturing 2017 600.00 853.84 42.31 Source Reduction: W51: Instituted recirculation within a process - At tool recycle capability is utilized. The equipment allows chemical recycling and reuse of NMP allowing the chemical to be used several times before disposal. A chemical stripper that contains 70% NMP, was also recycled at the tool in 2016 using a similar process.

Other Environmental Practices: Energy Recovery - N- Methyl-2-Pyrrolidone (NMP) WASTE RECLAMATION. A large portion of NMP waste was reclaimed and fuel blended for energy recovery off-site.
Other Environmental Practices: Recycling - N- Methyl-2-Pyrrolidone (NMP) WASTE RECLAMATION. A large portion of NMP waste was recycled through solvent recovery off-site. 		//enviro.epa.gov/enviro/P2_EF_Query.p2_report?FacilityId=05452BMXXX1000R&ChemicalId=0000872504&ReportingYear=2017&DocCtrlNum=1317216495236&Opt=0
05452BMXXX1000R GLOBALFOUNDRIES U.S. 2 LLC - VERMONT FACILITY (GLOBALFOUNDRIES US INC) 1000 RIVER ST,
ESSEX JUNCTION,
VT 05452		 Ammonia 334413: Semiconductor and Related Device Manufacturing 2018 9,286.00 13,294.24 43.16 Source Reduction: W58: Other process modifications - POST BPSG Chemical Mechanical Polish clean elimination: This step utilized Hydrochloric Acid, Hydrogen peroxide, sulfuric acid, Dilute Hydrofluoric Acid, and Ammonium Hydroxide.

 //enviro.epa.gov/enviro/P2_EF_Query.p2_report?FacilityId=05452BMXXX1000R&ChemicalId=0007664417&ReportingYear=2018&DocCtrlNum=1318217525486&Opt=0
05452BMXXX1000R GLOBALFOUNDRIES U.S. 2 LLC - VERMONT FACILITY (GLOBALFOUNDRIES US INC) 1000 RIVER ST,
ESSEX JUNCTION,
VT 05452		 Ammonia 334413: Semiconductor and Related Device Manufacturing 2024 20,145.00 30,759.00 52.69 Source Reduction: S25: Other process modifications made - Elimination of manufacturing process step

Source Reduction: Elimination of manufacturing process step 		//enviro.epa.gov/enviro/P2_EF_Query.p2_report?FacilityId=05452BMXXX1000R&ChemicalId=0007664417&ReportingYear=2024&DocCtrlNum=1324223131970&Opt=0
05452BMXXX1000R GLOBALFOUNDRIES U.S. 2 LLC - VERMONT FACILITY (GLOBALFOUNDRIES US INC) 1000 RIVER ST,
ESSEX JUNCTION,
VT 05452		 Ethylene glycol 334413: Semiconductor and Related Device Manufacturing 2021 800.00 1,224.00 53 Source Reduction: S25: Other process modifications made

 //enviro.epa.gov/enviro/P2_EF_Query.p2_report?FacilityId=05452BMXXX1000R&ChemicalId=0000107211&ReportingYear=2021&DocCtrlNum=1321220498923&Opt=0
05452BMXXX1000R GLOBALFOUNDRIES U.S. 2 LLC - VERMONT FACILITY (GLOBALFOUNDRIES US INC) 1000 RIVER ST,
ESSEX JUNCTION,
VT 05452		 Ethylene glycol 334413: Semiconductor and Related Device Manufacturing 2018 787.79 1,211.35 53.77 Source Reduction: W42: Substituted raw materials - Focus continues on the elimination of ethylene glycol and its replacement with a less toxic chemical, such as propylene glycol, where feasible.

Other Environmental Practices: Waste Treatment - On-site treatment of HF/EG mix waste at the sites Biological Wastewater Treatment Plant (BWTP) contributed to the elimination off-site shipments of hazardous waste.Treatability studies were performed to demonstrate the ability of the Biological Wastewater Treatment Plant (BWTP) to fully treat ethylene glycol. This has reduced the quantity of hazardous waste requiring off-site treatment. 		//enviro.epa.gov/enviro/P2_EF_Query.p2_report?FacilityId=05452BMXXX1000R&ChemicalId=0000107211&ReportingYear=2018&DocCtrlNum=1318217525498&Opt=0
05452BMXXX1000R GLOBALFOUNDRIES U.S. 2 LLC - VERMONT FACILITY (GLOBALFOUNDRIES US INC) 1000 RIVER ST,
ESSEX JUNCTION,
VT 05452		 Ammonia 334413: Semiconductor and Related Device Manufacturing 2016 10,763.00 19,937.00 85.24 Source Reduction: W58: Other process modifications - In 2016, the surface prep team worked on optimizing multiple chemical cleaning steps, and where technically feasible combining them into one chemical cleaning step, thus resulting in process optimizations and associated chemical savings. The chemical savings resulting from multiple process optimizations in 2016 were as follows: Project 1: Ammonium Hydroxide 92 gals, Dilute HF (49%) 1 gal, DI water Rinse 694,230 gals, DI water 390,512 gals Project 2 : Ammonium Hydroxide 827 gals, Hydrogen Peroxide 3537 gals, Hydrochloric Acid 672 gals, Isopropyl Alcohol 8818 gals, Sulfuric Acid 5683 gals, Hot DI 694,230 gals, Cold DI water 390,512 gals, Hydrofluoric Acid 41 gals
Source Reduction: W78: Other surface preparation and finishing modifications - Product Batch Size Optimizations for optimized chemical use: In 2015, the surface prep team began evaluation of batch size optimizations on certain manufacturing tools. The goal of this project was to optimize batch size so more product could be run using the same amount of chemical. The idea was implemented in 2016. The chemicals optimized included hydrofluoric acid, sulfuric acid, hydrogen peroxide, hydrochloric acid, and ammonium hydroxide. Chemical savings from batching were 13% on one tool set and 24 % on the other tool set.

 //enviro.epa.gov/enviro/P2_EF_Query.p2_report?FacilityId=05452BMXXX1000R&ChemicalId=0007664417&ReportingYear=2016&DocCtrlNum=1316215804776&Opt=0
05452BMXXX1000R GLOBALFOUNDRIES U.S. 2 LLC - VERMONT FACILITY (GLOBALFOUNDRIES US INC) 1000 RIVER ST,
ESSEX JUNCTION,
VT 05452		 Ammonia 334413: Semiconductor and Related Device Manufacturing 2019 13,294.24 36,713.00 176.16 Source Reduction: W58: Other process modifications

 //enviro.epa.gov/enviro/P2_EF_Query.p2_report?FacilityId=05452BMXXX1000R&ChemicalId=0007664417&ReportingYear=2019&DocCtrlNum=1319218396618&Opt=0
05452BMXXX1000R GLOBALFOUNDRIES U.S. 2 LLC - VERMONT FACILITY (GLOBALFOUNDRIES US INC) 1000 RIVER ST,
ESSEX JUNCTION,
VT 05452		 N-Methyl-2-pyrrolidone 334413: Semiconductor and Related Device Manufacturing 2019 857.63 3,169.00 269.51 Other Environmental Practices: Energy Recovery - N- Methyl-2-Pyrrolidone (NMP) WASTE RECLAMATION. A large portion of NMP waste was reclaimed and fuel blended for energyrecovery.
Other Environmental Practices: Recycling - N- Methyl-2-Pyrrolidone (NMP) WASTE RECYCLE. A large portion of NMP waste was recycled through solvent recovery off-site. 		//enviro.epa.gov/enviro/P2_EF_Query.p2_report?FacilityId=05452BMXXX1000R&ChemicalId=0000872504&ReportingYear=2019&DocCtrlNum=1319218396632&Opt=0
05452BMXXX1000R GLOBALFOUNDRIES U.S. 2 LLC - VERMONT FACILITY (GLOBALFOUNDRIES US INC) 1000 RIVER ST,
ESSEX JUNCTION,
VT 05452		 Fluorine 334413: Semiconductor and Related Device Manufacturing 2018 0 1,602.00 Source Reduction: W58: Other process modifications - Installation of point of use burn boxes.

 //enviro.epa.gov/enviro/P2_EF_Query.p2_report?FacilityId=05452BMXXX1000R&ChemicalId=0007782414&ReportingYear=2018&DocCtrlNum=1318217527959&Opt=0
05452BMXXX1000R GLOBALFOUNDRIES U.S. 2 LLC - VERMONT FACILITY (GLOBALFOUNDRIES US INC) 1000 RIVER ST,
ESSEX JUNCTION,
VT 05452		 Ozone 334413: Semiconductor and Related Device Manufacturing 2019 0 50.00 Source Reduction: W52: Modified equipment, layout, or piping

 //enviro.epa.gov/enviro/P2_EF_Query.p2_report?FacilityId=05452BMXXX1000R&ChemicalId=0010028156&ReportingYear=2019&DocCtrlNum=1319218396669&Opt=0


* - Dioxin releases are in grams; all others in pounds