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Facility ID: 45309MCGRG365CA
Facility Name and Address: MCGREGOR ASSOCIATES INC 365 CARR DR BROOKVILLE, OH 45309 Parent Company: MCGREGOR ASSOCIATES Industry: Printed Circuit Assembly (Electronic Assembly) Manufacturing (334418) Chemical: Lead Reports: View TRI Facility profile report for this facility View TRI Form R submissions by this facility |
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Production Related Waste Management for Selected Chemical
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Pollution Prevention Activities for Selected Chemical
Reporting Year | Section 8.10: Newly Implemented Source Reduction Activity | Section 8.10: Methods to Identify Activity | Section 8.11: Optional Pollution Prevention Information* |
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2022 |
Source Reduction:: S05: Modified content, grade, or purity of a chemical input[-0-4%]
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Methods to Identify SR Opportunities: T05: Employee recommendation (independent of a formal company program)
Barriers: B3-Barriers to P2 B3 - Concern that product quality may decline as a result of source reduction. |
S05: We tried mixing our lead solder, and we started replenishing with lead-free solder on refills. We found that the most we can refill with lead-free is 500# per year. Any levels greater than this will cause the lead solder purity to fail. Max monthly refill with lead-free solder is 41# per month. Source Reduction - The machine operator asked management if he could mix the lead-free solder alloy with lead alloy. We had an excess inventory of lead-free solder that she wanted to use instead of purchasing more lead solder alloy. Other Environmental Practices: Recycling - The dross that is developed from wave soldering is sent off-site to be reclaimed. for the year 2024, we are evaluating equipment for internal reclaiming which should reduce the amount we sent off site to be reclaimed by 80% Barriers to P2: B3 - Concern that product quality may decline as a result of source reduction. - Industrial controls and military products have not been allowed to use a lead-free soldering material. Tin whiskering is a major concern of product failure. |
2021 |
Source Reduction:: S44: Other improvements to operating practices and training
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Methods to Identify SR Opportunities: T09: Trade association/industry technical assistance program
Barriers: B1-Barriers to P2 B1 - Insufficient capital to install new source reduction equipment or implement new source reduction activities/initiat Barriers: B4-Barriers to P2 B4 - Source reduction activities were implemented but were unsuccessful. |
S44: Working with customer to remove lead and use RoHS Soldering alloy Barriers to P2: B4 - Source reduction activities were implemented but were unsuccessful. - Customers still have concerns with Solder alloys without lead. Samples have been supplied for testing "WP". Barriers to P2: B1 - Insufficient capital to install new source reduction equipment or implement new source reduction activities/initiat - Older equipment we run has issue with the RoHs solder. hoven heat capabilities. reduction in production do to conveyor speed |
2020 |
Source Reduction:: W42: Substituted raw materials[-15-24%]
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Methods to Identify SR Opportunities: T10: Vendor assistance
Methods to Identify SR Opportunities: T11: Other Barriers: B3-Barriers to P2 B3 - Concern that product quality may decline as a result of source reduction. |
W42: Try and have customers remove the lead from assemblies by going with a leadless element. (SOLDER) Other Barriers to Source Reduction - We are a contract manufacture and build to customer supplied prints. There is a movement for some of our consumer product customers to start using lead free solder. Barriers to P2: B3 - Concern that product quality may decline as a result of source reduction. - We build ground power support for the government Aircraft. Lead free solder is not permitted to be used. |
2019 |
Source Reduction:: W82: Modified design or composition of product[-15-24%]
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Methods to Identify SR Opportunities: T11: Other
Methods to Identify SR Opportunities: T10: Vendor assistance Barriers: B3-Barriers to P2 B3 - Concern that product quality may decline as a result of source reduction. |
W82: replace lead solder with lead free solder Source Reduction - Customers are changing to meet government guidelines Other Environmental Practices - We are a contract manufacture and we do not own the design. However, we work with the design teams to reduce or eliminate lead in product. Barriers to P2: B3 - Concern that product quality may decline as a result of source reduction. - Military need to perform further testing to remove the lead from the solder used on some of there Printed circuit boards |
2018 |
Source Reduction: Source Reduction - Alternative assembly materials are being used were applicable. |
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2017 |
Source Reduction: Source Reduction - Customer are starting the change to remove LEAD from there assemblies. |
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2016 |
Source Reduction:: W82: Modified design or composition of product[-0-4%]
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Methods to Identify SR Opportunities: T11: Other
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W82: We are reducing the LEAD alloy content in our solder on some old product and new product. Working towards "Rohs" compliance. Source Reduction - Product design change |
2015 |
Other Barriers to Source Reduction - Customers to redesign PCBAs to use Lead Free solder. We are the contract manufacture and build to customer prints. |
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2012 |
Other Barriers to Source Reduction - Customer want lead solder. Lead free solder is not as reliable. |
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2006 |
Source Reduction:: W13: Improved maintenance scheduling, recordkeeping, or procedures
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Methods to Identify SR Opportunities: T04: Participative team management
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2005 |
Source Reduction:: W13: Improved maintenance scheduling, recordkeeping, or procedures
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Methods to Identify SR Opportunities: T04: Participative team management
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2004 |
Source Reduction:: W13: Improved maintenance scheduling, recordkeeping, or procedures
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Methods to Identify SR Opportunities: T10: Vendor assistance
Methods to Identify SR Opportunities: T05: Employee recommendation (independent of a formal company program) |